指点财津 | “芯片四方联盟”是美国设计的鸿门宴

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近日，美国政府通过了《芯片和科学法案》，试图建立一个包括日本、中国台湾地区和韩国在内的“芯片四方联盟”。拜登政府为鼓励亚洲芯片巨头公司在美国建厂，承诺提供超过500亿美元的税收减免和补贴。看似“利好”的优惠政策，实则是一场“鸿门宴”。本期《指点财津》，CGTN郑峻峰为你解读！

The U.S. government has passed the CHIPS and Science Act and is trying to set up the "Chip 4" semiconductor alliance, which includes Japan, China's Taiwan region and South Korea. The Biden administration is committing over $50 billion in tax credits and subsidies to encourage chip giants to build plants in the United States. These seemingly good policies are actually a "Hongmen Banquet," a famous Chinese expression to describe a feast set up as a trap for the invited, as CGTN's Zheng Junfeng argues in this episode of BizBeat.

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