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科技 | 第三代半导体器件研发应用联合实验室在美的揭牌

2017-09-05 苏宇泉 美的家用空调研发中心

9月1日,美的家用空调与华南理工大学、镓能半导体(佛山)有限公司、厦门芯光润泽科技有限公司四方共建第三代半导体器件研发应用联合实验室协议签署和揭牌仪式在美的家用空调事业部举行。佛山市科技局梁达明副局长、叶伟峰科长、华南理工大学电子与信息学院院长李斌、镓能半导体(佛山)有限公司总经理李孟、厦门芯光润泽科技有限公司总经理徐晓辉,以及家用空调事业部李金波、李猛、冯宇翔、段文训等各方专家和领导出席了仪式。

随着半导体科学的迅速发展,以氮化镓和碳化硅为代表的第三代半导体展现出了许多硅基材料无法比拟的优势,但是在器件制备和实际应用上还面临着一系列的困难。此次合作的各方,美的拥有丰富的下游应用经验,可以把握器件的设计方向,并对应用效果进行验证;华南理工大学作为国内微电子领域的重要高校之一,负责器件理论机理和系统应用方向的基础研发;镓能半导体和芯光润泽分别在氮化镓和碳化硅器件领域拥有丰富的设计与封装经验,将为联合实验室提供器件、芯片和模块等方面的技术支援。联合实验室的成立,旨在结合高校和企业各自的优势,四方将依托该联合实验室平台,立足于第三代半导体,在技术研究、市场应用、人才培养等方面建立全面的、长期的、稳定的战略合作伙伴关系。

 

四方签约


实验室揭牌


李猛介绍美的


李斌介绍华南理工大学微电子学院


李孟介绍镓能


徐晓辉介绍芯光润泽


冯宇翔介绍联合实验室概况


梁达明副局长一行参观IPM实验室


Third-generation Semiconductors Joint Laboratory Inaugurated in Midea


September 1st, Midea, South China University of Technology, China SiC Power, and GaN Power cooperated to build third-generation semiconductors joint laboratory. The signing and opening ceremony was held at residentialair conditioner division. Bin Li, dean of school of electronic and information engineering of SCUT, Meng Li, general manager of GaN Power, Xiaohui Xu, generalmanager of China SiC Power, Kimble Li, Burce Li, Mike Feng, Wenxun Duan fromMidea, and other cooperation partners attended the ceremony.

The third generation semiconductor, including GaN and SiC, has exhibited many advantages comparing to Si in power electronics.The quartet will rely on the joint laboratory platform to move forward on technologyresearch, market application, personnel training and other aspects in the field of the third generation semiconductor and chip technology. Among them, Midea has a rich experience in the design of downstream applications, can grasp the direction of the device, and verify the effect; SCUT is one of the top schools in the research of semiconductor and electronics; GaN Power and China SiC Poweris expert in GaN and SiC device, respectively.


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