恩智浦2021校园招聘春季补招岗位，"职"等你来！
恩智浦2021校园招聘春季补招进行中
一年之计在于春，扬帆奋进正当时。同学们快抓紧最后机会！
申请方式①将简历投递至：talent@nxp.com邮件注明：姓名+申请职位+工作城市
申请方式②
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上海
Responsibilities:
- Be responsible for digital IP and subsystem level verification.
- Create verification plans with designers.
- Develop DV architecture and verification environment.
- Verification execution and sign-off.
- Interface to HW and SW design teams, as well as to architecture and system engineering teams, to understand functionality and application of the IP subsystem / SoC / system.
Requirements:
- Master degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Solid background with ASIC design verification flow and multiple ASIC tape out experience.
- Complex IP/ASIC/SOC design verification background, direct experience in IP/SOC or Industry bus standard (Display, HDMI, DP, MIPI or high speed IO interface).
- Familiar with System Verilog/UVM for testbench creation, debug, reuse, constrained-random stimulus and functional coverage.
- Solid knowledge on System Verilog, C/C++, Verilog.
- Solid background with hardware verification methodologies such as coverage-based verification methodology with the use of hardware assertions (PSL or SVA).
- Good communication skills and team work.
- Good oral and written English skills.
Responsibilities:
- Work with global design teams to do complex SoC verification for digital/analog mixed large/Complex SoC design.
- Block level verification based on System Verilog & UVM methodology for the complex new IP design.
- Responsible for verification plan quality, verification result/design target cross-check, test case development to have better coverage and verification quality.
- Co-work with functional verification team to ensure the complex SoC verification functional coverage and quality.
Requirements:
- Bachelor or master’s degree in Microelectronics, Electronics, Electronic Engineering, Computer Science or relevant disciplines.
- Good knowledge and experience in C/C++/Verilog/System Verilog/UVM programming languages, familiar with IC simulation & debug flow and tools, testbench build, unix/linux environment, tcl/perl script etc.
- Good Knowledge of computer architecture, especially ARM CPU(Cortex A/M series), bus protocols(APB/AHB/AXI), verification experience of ARM-based SoC is a plus.
Responsibilities:
- Support wireless connectivity (WiFi, Bluetooth) software integration and bring-up.
- Debug and resolve software issues reported by customers.
- Drive internal co-work and provide customer support timely.
- Support internal development and debug tasks as needed.
- Support customer remotely or onsite as needed.
Requirements:
- Master degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Be able to communicate in English, both written and spoken.
- Good contact and ability to work in a multicultural environment.
Responsibilities:
- Support wireless system integration and bring-up on customer platforms.
- Debug and resolve wireless issues reported by customers.
- Drive co-work with other teams (CAS, R&D, QA, etc.) to provide customer support timely.
- Support internal development and debug tasks. Support customer remotely or onsite as needed.
Requirements:
- Master degree or above, major in Electronic Engineering/Computer Science or other related discipline.
- Experience with C programming and debugging is required.
- Experience with Linux kernel and driver development is required.
- Knowledge of Wi-Fi MAC and standard is required.
- Knowledge of TCP/IP protocol is required.
- Knowledge of other wireless technologies (Bluetooth, Zigbee, UWB, etc.) is preferred.
- Knowledge of PCIe/SDIO/USB is preferred Fluent English Good teamwork and communication.
- Be willing to travel.
Responsibilities:
- Support WiFi SW & System integration into customer devices & ecosystem, by being directly involved in the customer pre-sales & design phases
- Take an active role during customers design-in, being consulted for design and system integration, like for reviewing customer SW architecture & code, supporting customer during bring-up or proposing SW fixes
- Act as SW System Expert interface with customers and NXP engineering teams
- Develop own Product/SW System competencies and Ensure knowledge transfer to CAS Engineers.
- Contribute in delivering the Product Support Package in time with high quality level (Application Notes, board development, reference design, training).
- Ensure the ramp-up (skills) of the local team, by providing training and support to regional CAS 1st line engineers.
Requirements:
- Master degree or above, major in Embedded Software/Electronic Engineering/Computer Science or other related discipline.
- WiFi Systems knowledge, including: WiFi system concept, modulation principle & signal processing, standards & protocol.
- SW coding and programming ability in C.
- Experience in Linux kernel and driver development is preferred.
- Knowledge of SW debugging tools, environment & methodology.
- Knowledge of System HW aspects like buses (I2C, SPI, UART).
- Knowledge of TCP/IP protocol is preferred.
- Ability to face customers in meetings, calls and lab sessions.
- Fast reactivity and ability to manage crisis (methodology, synthesis, drive, communication).
- Excellent communication in English (written or spoken).
- Good contact and ability to work in a multicultural environment.
- Strong analytical mind.
天津
Responsibilities:
- Be responsible for analyzing the problem IC to find the root cause of failure, such as customer application problem, wafer manufacture defect, assembly package issue, etc.
- Be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem.
- Analyze devices include new designs/products, low yield on existing products, qualification failures, and returns from customers.
- Reproduce electrical failures in a lab environment and locate/characterize defect or anomaly using a variety of electrical, optical, and physical techniques.
- Collaborate with experts within the FA lab and other organizations, e.g., Design, Test, and Manufacturing.
- Document FA results in formal failure analysis reports.
- Analyze techniques involving a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behavior depressing of the packaged device in order to identify the cause of failure.
- In addition many advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), EMMI and Laser Induced Electrical Stimulation tools (e.g. OBIRCH) are used in the investigation, isolation and identification of problems.
Requirements:
- Master’s degree in Electrical Engineering Science or other related disciplines.
- Demonstrated data analysis and problem solving skills.
- An in-depth understanding Analog and digital circuits are required.
- Ability to resolve complex customer issues and lead cross-functional teams.
- Strong English written and verbal communication and presentation skills and ability to influence others.
- Process control and other six sigma tools knowledge.
- Flexibility to adjust to change and multiple ongoing issues in a fast-paced, customer-focused environment.
- Ability to work independent of management with leadership skills.
Responsibilities:
- Define and validate package designs, materials and processes used for development of new products for NXP.
- Develop DOE’s and tests to evaluate suitability and reliability of package solutions.
- Work with the Business Lines and the factories (both internal to NXP and subcons) to qualify the package/product solutions.
- Manage the package process using industry standard project management tools.
- Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
- Address and solve materials and processing issues that may occur during the development process.
- May involve international travel to package assembly sites and NXP suppliers.
Requirements:
- Master Degree or above in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering.
- Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
- Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.
- Knowledge of Statistical Analysis and Design of Experiment is a plus.
- Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.
Responsibilities:
- Regular equipment maintenance and continues improvement.
- Keep product line equipment run efficiently.
- Analyze and resolve problem with equipment to reach zero defect.
- Coordinate with equipment supplier to improve equipment capacity.
Requirements:
- Bachelor degree or above, major in Mechanical or Automation related major.
- Good communication and team spirit.
- Good command of English writing and reading.
Responsibilities:
- New product introduction, qualifications, production start-up from Probe to Final Test NPI support.
- Be responsible for probe NPI new product introduction and product test performance improvement.
Requirements:
- Bachelor degree or above in Electrical, Electronics or other related disciplines.
- Knowledge on product NPI start-up.
- Proven skills in failure analysis, test software programming, statistical analysis, and/or test methodology development.
- Knowledge of UNIX/LINUX, Perl, C/C++, VB, and assembly language programming is an added advantage.
- Strong communication skill with fluent spoken, listening, reading and written English and communication with internal and oversea work colleagues.
- Have strong skill of self-learning and working independence as well as good team work. Initiative, creative and proactive.
Responsibilities:
- Create and manage Package data and data structures for Package Innovation, NXP factories and NXP BLs.
- Manage and support NXP Package Innovation documents and document control (OMS).
- Represent Package Innovation in data base change projects.
- Interact with Package Innovation engineers and engineering managers to remove system roadblocks to development projects
Requirements:
- Bachelor degree or above in Electrical, Electronics or other related disciplines.
- Familiar with PCs and Microsoft Office products.
- Understand Data Base and Data Base administration
- Understanding of hierarchical and Indented Data structures
- Proficient in English, will need to consult and support worldwide NXP colleagues
Responsibilities:
- Manage customer return process including problem solving process.
- Provide follow-up on all customer failure analyses, communication and issue resolution at all levels.
- Act as customer advocate for product quality. This includes customer and internal management communications and presentations, for customer and internal quality reviews.
- Customer interaction and negotiation on quality cases solving.
- Customer loyalty development.
- Interface with internal and external factories on reliability and quality issues.
- Support continuous improvement, defect reduction activities, and cost reduction activities.
- Lead product teams, factories, and associated support through quality issue resolution process.
- Support customers with technical reliability and quality consult.
- Work with customers to address product reliability and quality issues.
- Coordinate and/or Participate in the Change Action Board (CAB).
- Participate in Material Review Boards (MRB).
Requirements:
- Bachelor Degree or above in Electrical Engineering, Science or other related disciplines.
- Application Engineering or Design Experience on microprocessor
- Demonstrated data analysis and problem solving skills.
- Ability to resolve complex customer issues and lead cross-functional teams.
- Strong written and verbal communication and presentation skills and ability to influence others.
- Process control and other six sigma tools knowledge.
- Flexibility to adjust to change and multiple ongoing issues in a fast-paced, customer-focused environment.
- Ability to work independent of management with leadership skills.
- Application Engineering experience would be an advantage.
- Overseas education and/or working experience are preferred.
Responsibilities:
- Work with cross functional team on NPI and sustaining product qualification projects intake, plan and execution.
- Work with cross functional team on reject sample failure analysis, root cause investigation and issue fix.
- Develop and debug operation lifetime test and biased environmental stress test hardware and software for new products.
- Reliability accelerate stress test specification and equipment operation procedure owner.
- Work with designer and product engineer to develop ESD test program.
- New reliability stress test capability evaluation, development and setup.
Requirements:
- Bachelor Degree or above in Microelectronics science, Electrical engineering or other related technical field.
- Understanding and knowledge on semiconductor wafer processing.
- Understanding and Knowledge on embedded systems (microcontrollers and microprocessors).
- Good board level hardware design and development knowledge and skills.
- Solid C programming knowledge and experience for embedded systems.
- Good level on oral and written English, CET6.
- Good communication skill and team work spirit, willing to learn, take on challenges and self-motivated.
- Knowledge of common computer software packages, such as Word, Excel, PowerPoint, etc.
Responsibilities:
- Be responsible for planning, implementing, and maintaining the infrastructure and equipment of buildings and facilities.
- Perform analyses of operational processes, resource allocation, energy use, and safety processes, and recommend and implement improvements.
- Facility system management (ie. High voltage power system) the urgent troubleshooting, some general affair.
Requirements:
- Bachelor degree or above, major in Electronic related disciplines.
- Fluent in English, both writing and speaking.
- Master Microsoft office applications.
- Independent problem-solving, organization, interpersonal and communication skills.
- Good ability to learn new knowledge.
- Self-motivated and teamwork spirit.
Responsibilities:
- Facility shift operation to monitor & operate facility system(e.g. High voltage power system).
- Deal with urgent trouble shooting and some general affairs.
Requirements:
- Bachelor degree or above, major in Engineering related majors such as electronics, automation etc.
- Electrician's high-pressure operation certificate or a boiler operation certificate are preferred.
- Be self-motivated and have teamwork spirit.
Responsibilities:
- Be responsible for planning, implementing, and maintaining the infrastructure and equipment of buildings and facilities.
- Perform analysis of operational processes, resource allocation, energy use, and safety processes, and recommend and implement improvements.
- Facility system management (ie.HVAC,WWTP,UPW,CDA)
- Support the urgent troubleshooting and some general affair.
Requirements:
- Bachelor degree or above, major in Electronic related.
- Fluent in English, both writing and speaking.
- Master in Microsoft office applications.
- Have independent problem-solving, organization, interpersonal and communication skills.
- Have good ability to learn new knowledge.
- Be self-motivated and have teamwork spirit.
Responsibilities:
- Facility shift operation to monior & operate facility system (e.g .HVAC,WWTP,UPW,CDA,High voltage power system.
- Deal with urgent troubleshooting and some general affair.
Requirements:
- Bachelor degree or above, major in Machinery Engineering or other related fields.
- Be self-motivated and have teamwork spirit.
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