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社招 | 射频相关职位热招中,快来锁定你的offer!

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恩智浦是在射频创新和技术方面拥有60多年经验的领军企业,提供广泛的射频产品组合,适合从毫瓦到千瓦的移动通信、汽车电子、工业和消费电子市场。


有1.8 mW至1.8 kW、DC至47 GHz的LDMOS、GaN和SiGe射频功率解决方案,面向通信和工业应用的分立式晶体管、集成电路和多芯片模块。在航空与国防、移动通信基础设施、医疗、广播、移动无线电等领域都有广泛应用。




从天线到处理器,恩智浦提供了强大的技术产品组合,以支持5G接入边缘技术,为基础设施、工业和汽车应用提供一流的性能和安全性。其中包括恩智浦的Airfast射频功率解决方案系列,以及Layerscape系列可编程基带处理器,适用于无线数据链路、固定无线接入和小型基站设备。


射频相关社招职位火热招募中,

快来申请吧~

申请方式①

将简历投递至:talent@nxp.com

邮件注明:姓名+申请职位+工作城市


申请方式②

点击文末"阅读全文",

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#1

Senior RF Design Engineer

Location: Chengdu

(上下滑动浏览岗位职责)

Responsibilities:

- Develop discrete and integrated power transistors and SIP up to 6GHz for cellular, emerging, small signal and RF power markets based on GaN, LDMOS and SiGe technology. Involves electromagnetic simulation, modeling and low impedance transistor internal and external matching networks, passive components and substrate simulation and layout.

- Design integrated passives network, wire bonds, packaging interfaces and PCB board level matching. The design process uses a combination of measurement based techniques (e.g. loadpull and S parameter data, etc) and CAD software with the use of linear or non-linear models and design kits.

- Make use of Agilent’s ADS, Momentum, FEM, 3D and planar electromagnetic simulation tools. Work closely with global device & package engineers, product engineers, project managers, modeling engineers, application engineers and manufacturing personnel for successful and timely product introduction, and report to local management team. 


Requirements:

- Bachelor degree or above, major in electrical engineering or other related disciplines.

- Above 2 years’ work experience in RF power transistor and circuit design.

- Direct experience in designing RF power transistor internal-matching networks using GaN, LDMOS, etc.

- Direct experience working with RF power products at the RF system level is preferred. 

- Strong communication skills and ability to work with global teams. 

- Self motivator and able to work independently.

- Good language skills in English.

- Have a strong background on microwave and RF engineering, and emphasis on one or several of the following areas is highly desirable:

· Hands-on experience with board level tuning and optimization of internal and external matching networks.

· Experience and understanding of power amplifier, circuit linearization and high-efficiency design techniques.

· Microwave measurement techniques (s-parameters, loadpull setups, VNA calibration techniques, spectrum analyzers, power meters, etc).

· Working knowledge with Agilent's Advanced Design System (ADS) and HFSS.

#2

Sr RF Design Engineer-Team Leader

Location: Chengdu / Shanghai

(上下滑动浏览岗位职责)

Responsibilities:

- Act as a senior member of the design team playing a leading role in designing innovative RF IC PA circuits and solving technical issues.

- Create innovative RF and micro/mm-wave PA circuit designs, with an emphasis on RF power amplifiers, pushing the performance of the SiGe transistors and passive devices to their limit to maximize the RF IC performance.

- Translate the product requirements into optimal RF topology choices.

- Define and optimize the RF IC architecture and block partitioning to meet the overall system requirements of the application.

- Run design simulations to validate product performance using design kit models in realistic topologies.

- Take care of design reporting.

- Support the customer interface in understanding application requirements and assuring technical feasibility during the product development phase. 

- Provide technical support to characterization, test, product and qualification engineers.

- Peer reviewing with other designers and cross-functional. 


Requirements: 

- 5-10 years’ experience in RF IC design, with broad experience in power amplifier (PA) design.

- Strong background in semiconductor physics.

- Experience of relevant CAD tools (Cadence and ADS flows) and IC design methodology.

- Experience with modelling thermal behavior of designs: die-package-PCB.

- Experience with modelling metal interconnect using EM tools: die-package-PCB.

- Structured IC design methodology covering specification, implementation, design and test.

- Driven to achieve success and able to work in a team of expert engineers to reach clear design goals.

- Fluent in English language both oral and written.

- Excellent communication skills, both verbal and in writing. 

- Initiative and entrepreneurial attitude. Creative.


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(直接点击下方文字↓)

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恩智浦5G射频多芯片模块升级啦!

频率扩至4.0GHz,效率提升45%,功率增加20%

赋能5G大规模MIMO天线无线电单元,

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5G Wireless Infrastructure 

for a Connected World



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