查看原文
其他

实习 | We offer you a job!

2021年也迎来了尾声,

这一年来,你的小心愿实现了几个呢?

寒假来临,新年将至,

你一定想要一个新的开始,

2022年要加油冲呀!

小编为你准备了大量实习岗位,

快来Pick你心仪的那个吧~


只要你符合以下条件:

2022/2023年毕业的本科/硕士生

电子/计算机/通信/会计等相关专业

就可立即申请!


申请方式①

将简历投递至:China.Talent@nxp.com

邮件注明:姓名+申请职位+工作城市


申请方式②

点击文末"阅读全文",

找到职位,一键申请!

期待你的加入!


实习岗位

AI/IoT Software Engineer Intern

Location:Shanghai

R-10029987

(上下滑动启阅)

Responsibilities:

• Work within IoT and Security & Connectivity Solutions team to develop and integrate solutions (hardware and software) for addressing IoT applications, AI/Machine Learning, Connectivity and Edge Computing.

• Develop reference solutions that close to market trends for IoT and AI applications. Working with R&D teams to leverage the existing designs or plans and productize the customer needed solutions.

• Investigate and analyze consumer and industrial market applications and competitors’ solutions. Work closely with Marketing/FAE teams to clearly understanding customer's requirement and expectation. To design and develop the competitive solutions that brings into revenue.


Qualifications:

• Master or Bachelor’s degree in mathematics, electronic engineering, computer science or relevant disciplines.

• Highly welcome for the capability of algorithm research and full of strong interests to deep dive in algorithm development and innovation.

• Enthusiastic for embedded software development and with good coding style.

• Familiar with embedded RTOS software development for device driver or familiar with Linux OS.

• Full of interest for Artificial Intelligence & Machine Learning and nice to have basic knowledge.

• Good communication skills and fluent English for both speaking and listening.

• Value added if you have application experience in object / facial recognition or voice command and control research.




AP/MPU Systems & Applications 

Engineering (SW) Intern

Location:Shanghai

R-10030591

(上下滑动启阅)

Responsibilities:

• Attend NPI projects as a first internal customer – System validation, Create and review new product documentations, Out of Box Experience etc.

• Assist to develop i.MX reference designs and create demo applications for IoT/Industry/Networking.

• Assist to provide technical training to i.MX customers.

• Be responsible for system user case performance tuning and optimization.


Qualifications:

• Master or Bachelor’s degree in Electrical Engineering, Computer Science or relevant disciplines.

• Strong programming skills on C language.

• Hands-On experiences with Linux Kernel/BSP or Android is a good plus.

• Strong initiative and learning willingness.

• Good English ability in listening, speaking, reading and writing.

• Good communications and presentation skills




Linux Graphics Intern

Location:Shanghai

R-10030687

(上下滑动启阅)

Responsibilities:

• Develop and deliver the qualified GPU driver for i.MX and layerscape SW releases.

• Integrate and upgrade graphics components on Linux desktop platform.


Qualifications:

• Master or Bachelor’s degree in in Electronics, Electrical Engineering, Computer Science or relevant disciplines.

• Good C/C++ programming on ARM embedded system with Linux/Android.

• Strong written and verbal communication skills.


MCU Systems Engineering Intern

Location:Suzhou

R-10034720

(上下滑动启阅)

Responsibilities:

• Develop/test demos/examples for NXP 32-bit ARM Cortex-M based MCUs.

• Write test report, user guide for demos/examples.

• Assist the systems engineer to do board rework, and some of logistic work.

• Assist marketing promotion activities.


Qualifications:

• Graduate, or undergraduate of 4th year in Electronic Engineering,  Computer Science, or the related.

• Skilled in embedded software development in C.

• Some experience in ARM Cortex-M based Microcontrollers.

• Good interpersonal communication skill, team work, and self-motivated• Nice to have know-how of ARM or AMBA system.




MPU BSP Software Intern

Location:Shanghai

R-10034067

(上下滑动启阅)

Responsibilities:

• Develop Linux and Android BSP for i.MX SoCs or i.MX ROM FW development.

• System SW integration.

• Build/test/analyze the result.

• Write report and other documents.

• New tech pre-study and experiments.


Qualifications:

• Postgraduate student.

• Can work 32 hours or above a week in NXP office.

• C/C++ coding skill and tools.

• Basic Linux kernel knowledge.

• English read/write/speak.

• Quick learner.




MPU Systems and Applications Engineer Intern

Location: Shanghai

R-10030395

(上下滑动启阅)

Responsibilities:

• Perform SoC validation such as high speed interface. Ethernet/HDMI/USB/SATA/DDR/PCIE/LVDS compliance test, Power subsystem, signal integrity etc.

• Assisting platform updates, which include driving and coordinating activities for board rework, test, and re-deployment.

• Build test software for FCC, CE and stress test.


Qualifications:

• Work 3 days/week and long-term internship (at least 6 months).

• Strong initiative and learning willingness.

• Familiar or willing to learn diagnostic equipment such as  Multimeter, Oscilloscope, etc.

• Software background with Windows and Linux operating systems, as well as some working knowledge of programming and scripting languages (for example, C, Python and others) would be an added advantage.

• Fluent written and verbal English communication skills would be an added advantage.




MPU Systems Engineer Intern

Location:Suzhou

R-10030696

(上下滑动启阅)

Responsibilities:

• Attend NPI projects as a first internal customer – System validation, Create and review new product documentations, Out of Box Experience etc.

• Assist to develop i.MX reference designs and create demo applications for IoT/Industry/Networking.

• Assist to provide technical training to i.MX customers.

• Be responsible for system user case performance tuning and optimization.


Qualifications:

• Master or Bachelor’s degree in Electrical Engineering, Computer Science or relevant disciplines.

• Strong programming skills on C language.

• Hands-On experiences with Linux Kernel/BSP or Android is a good plus.

• Hardware design and debug experience is a good plus.

• Strong capability for trouble shooting.

• Good embedded system level knowledge including both hardware and software.

• Strong initiative and learning willingness.

• Good English ability in listening, speaking, reading and writing.

• Good communications and presentation skills. 




Software Development Intern

Location:Beijing

R-10030787

(上下滑动启阅)

Responsibilities:

• Participate in the research and innovation of GUI and graphics software for NXP MCU.

• Develop widgets for graphic library and upstream source code to opensource community.

• Development of edge/IoT and cloud interaction for live update on templates.

• Support development for embedded graphic application for different use cases.

• Optimize graphics performance by utilizing hardware acceleration and hardware resource, e.g. GPU, RAM.

• Collaborate on NXP MCU graphics IDE development and release.

• Provide technique support for world-wide team and customer.

 

Qualifications:

• Master or Bachelor’s degree in Computer Science or relevant disciplines.

• Skill of C/C++ or Python for graphics development on ARM based MCU/MPU.

• Know about MCU device driver, GPU and embedded graphic library, such as LVGL, Edwin, QT.

• Familiar with RTOS on MCU/MPU, such as FreeRTOS, Zephyr, AzureRTOS or VxWorks, etc.

• English skill in reading and writing, oral and listening is preferred.

• Ability to work both independently and within a team.




Software Development Intern

Location:Beijng

R-10030929

(上下滑动启阅)

Responsibilities

• Be familiar with AI/ML and has experience with at least one ML framework Tensorflow/Keras, PyTorch, ONNXRuntime.

• Good at python programming, experience with AI/ML alogrithm development or model training/tunning will be better.

• Be familiar with embedded software, like as Linux, Android, etc. 

• Good communicaiton skill.


Qualifications:

• Bachelor or master’s degree in Microelectronics, Electronics, Electrical Engineering, Computer Science or relevant disciplines.

• Good knowledge and experience in DFT implementation methodology, flow optimization and DFT coverage improvement. Mentor tool is a plus.

• Strong problem solving skills, self-motivated and good team player.




Analog/Mixed-Signal Design Intern

Location:Tianjin

R-10030103

(上下滑动启阅)

Responsibilities:

• Design, implement and verify analog/mixed-signal IP.

• Provide technical guidance to layout, application, and validation engineers.

• Create thorough review documentation and follow established design flow.


Qualifications:

• Master’s degree in micro-electronics, electronic engineering or relevant disciplines.

• Basic knowledge in analog/mixed-signal IP design , verification and validation flow.

• Familiar with design EDA tool: Cadence Virtuoso, Hspice/Spectre, Calibre, Matlab, QRC, etc.

• Experience in LDO/ DCDC/ Data-Conversion / Clocking / OPAMP design is a plus.

• Good communication skills and teamwork for global projects support.




DFT Intern

Location:Suzhou/Tianjin

R-10030577/R-10030550

(上下滑动启阅)

Responsibilities:

• Proficiency in whole DFT architecture definition.

• Setup and maintain DFT flow, familiar with script language. 

• Be responsible for definition and implementation different schemes of DFT aspects: including scan/MBIST/JTAG insertion, ATPG generation, test patterns generation.

• Experience RTL/netlist simulation, good debug capability , familiar with Verilog.

• Experience with ATE on-line debugging and  DFT diagnosis. Experience with Post-silicon DPPM improvement , coverage hole analysis.


Qualifications:

• Bachelor or master’s degree in Microelectronics, Electronics, Electrical Engineering, Computer Science or relevant disciplines.

• Good knowledge and experience in DFT implementation methodology, flow optimization and DFT coverage improvement. Mentor tool is a plus.

• Strong problem solving skills, self-motivated and good team player.




Emulation Intern

Location:Tianjin

R-10030451

(上下滑动启阅)

Responsibilities:

• The position is responsible for developing verification plan, testcase, and verify the functionality MCU/MPU(Coretx-M/A) SOC and reporting the bugs in SOC or IP level.

 

Qualifications:

• Master’s degree in in electronic engineering, communication, computer Science.

• Knowledge of computer architecture, especially ARM CPU(Cortex A/M series), bus protocols(APB/AHB/AXI).

• Knowledge in  C language, and developing Custom UVM Agents and functional models in Verilog/System Verilog/UVM.

• Nice to have knowledge of script language (ex. Perl/Python).

• Self-motivation, flexibility, with strong interpersonal skills.

• Effective communication skills, oral and written skills.




SoC Backend Design Intern

Location:Suzhou

R-10030148

(上下滑动启阅)

Responsibilities:

• Work closely with SoC team (architects, logic designers, etc) for chip/block level physical designs.

• Responsible for chip and block level low power definition, RTL synthesis, logic/power equivalent check, clock tree synthesis, P&R, STA/timing noise closure, etc.

• Responsible for die size estimation, floor-plan and power/IR analysis, DRC/LVS, etc.


Qualifications:

• Bachelor or master degree, majoring in microelectronics, electronic engineering, computer science or relevant disciplines.

• Knowledge and experience in SoC backend flow and EDA tools.

• Script coding ability of C/C++, Perl/TCL, in Linux/Unix environment.

• Excellent communication skills and collaboration spirit.




SoC Digital Design Intern

Location:Shanghai/Suzhou/Tianjin

R-10030565/R-10030545/R-10030548

(上下滑动启阅)

Responsibilities :

• Main responsibility on SoC design for MCU/MPU with security and connectivity, which targets IoT/Edge/Auto application. 

• Responsibility to design subsystem and top logic/integration for SoC.

• Responsibility on quality of SoC design with quality check flow, such as LINT/CDC/RDC/CLP.

• Support IP design and SoC verification.

• Work closely with other function teams on architecture definition as well as power/timing analysis.

• Join design methodology innovation for application.


Qualifications:

• Pre-graduate with majoring in Microelectronics, electronic engineering, computer science or relevant disciplines.

• Knowledge in C/Verilog/SV/VHDL.

• Understand basic IC digital design and verification flow.

• Self-motivated for studying/working.

• Good co-operation as team-player.

• Nice to have knowledge of script language (ex. Perl/TCL/Python).

• Nice to have know-how of ARM or AMBA system.




SoC Implementation Intern

Location:Tianjin

R-10030377

(上下滑动启阅)

Responsibilities:

• Learn and execute tasks in leading-edge SoC product design.

• Work among full SoC implementation scope, from synthesis all the way to tape-out.

• Learn the technical challenges and make innovations to address them with access to our technical platform.

 

Qualifications:

• Bachelor/Master college students, major in micro-electronics, computer science or relevant disciplines.

• Highly interested in SoC hardware design and set it as target career.

• Enthusiasm, good communication.

• Minimum bandwidth is 4 day/week for 6 months.



SoC Verification Intern

Location:Shanghai/Suzhou/Tianjin

R-10030788/ R-10030572/ R-10030455

(上下滑动启阅)

Responsibilities:

• The position is responsible for developing verification plan, testcase, and verify the functionality MCU/MPU(Coretx-M/A) SOC and reporting the bugs in SOC or IP level.


Qualifications:

• Master’s Degree in EE/Communication/Computer Science.

• Knowledge of computer architecture, especially ARM CPU(Cortex A/M series), bus protocols(APB/AHB/AXI).

• Knowledge in  C language, and developing Custom UVM Agents and functional models in Verilog/System Verilog/UVM.

• Nice to have knowledge of script language (ex. Perl/Python).

• Self-motivation, flexibility, with strong interpersonal skills.

• Effective communication skills, oral and written skills.




Packaging Intern

Location:Tianjin

R-10032178

(上下滑动启阅)

Responsibilities:

• This position is a packaging back-end R&D engineer, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below:

- New packaging technology development

- New package related process development

- Advanced material interface study

- Advanced IC package failure analysis

- Coordinate/lead development project independently

- Communication/cooperation among global teams (US/Europe/Malaysia/Japan/France/etc.)

• English will be the language for written and oral communication; strong academic/technical background will be needed in order to initiate/complete advanced R&D projects independently.

 

Qualifications:

• Master’s Degree in Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.

• At least CET-4 degree or equivalent English level and CET-6 is preferred.

• Intention and capability to work in a cross-functional/global team environment.

• Independent R&D capability.

 

Preferred Qualifications:

• Excellent English communication skill.

• Project management and team management experience in university social activities. 

• Statistic analysis experience, GB/BB is preferred.



Customer Quality Intern

Location:Tianjin

R-10030795

(上下滑动启阅)

Responsibilities:

• Manage customer return process including problem solving process.

• Provide follow-up on all customer failure analyses, communication and issue resolution at all levels.

• Act as customer advocate for product quality. This includes customer and internal management communications and presentations, for customer and internal quality reviews.


Qualifications:

• Bachelor’s Degree Bachelor's Degree or above in Electrical Engineering, Science.

• Demonstrated data analysis and problem solving skills.

• Strong written and verbal communication and presentation skills and ability to influence others.

• Process control and other six sigma tools knowledge.

• Ability to work independent.

• Overseas education and/or working experience are preferred.




EHS Systems Intern

Location:Tianjin

R-10023280

(上下滑动启阅)

Responsibilities:

• EHS system maintenance.

• Assist the organization and execution of scheduled EHS events e.g. Health Campaign, Health Talk sessions, etc.

• Support local regulatory compliance tracking and validation of compliance activities.


Qualifications:

• Bachelor's Degree major in Safety, Chemistry, Environment or English related.

• Good command of English and communications.

• Passionate on EHS management.

• Proficient in English and communications.

• Experience in organizing or coordinating events.                              

• IT related background, well known about Android and Java, it would be preferred to whom familiar with Grails.




Finance Intern

Location:Shanghai

R-10034021

(上下滑动启阅)

Responsibilities:

• Finance document filing.

• Concur report registration.

• VAT invoice verification.

• Other ad hoc F&A jobs.

 

Qualifications:

• Bachelor’s Degree in Accounting, Finance, Statistics or related fields.

• Be proficient in MS Office (Excel, PPT) etc.

• Good command of both spoken and written English and Chinese.

• Attentions to details.

• Strong sense of responsibility.

• Strong communication skills.

• Self-starter.



Product/Test Intern

Location:Tianjin

R-10030415

(上下滑动启阅)

Responsibilities:

• Support product and test engineering team to finish the routine job, include but not limited with below work scope:

• Responsible for assisting NPI project in daily tasks such as: performing the test program correlations, reject verifications, qualification testing, engineering services request and etc. 

• Collect and summarize engineering test data.

• Ability to troubleshooting hardware/equipment, first level debug and do sanity check on test SW and HW.

• To support and perform engineering evaluation (ATE/bench). 

• Coordinate engineering samples handling (before internal lab, MFG flow and shipping across different sites).

• Engineering material and HW management.  

        

Qualifications:

• Master’s degree, majoring in Microelectronics, electronic engineering, computer science or relevant disciplines.

• Understand digital design and verification flow.

• Excellent problem analyzing/solving skills. Good collaboration skillset to support global projects. Hard working and team player.

• Good knowledge in C language, Verilog/VHDL/System Verilog.

• Nice to have knowledge of script language (ex. Perl/TCL/Python).

• Nice to have know-how of ARM or AMBA system.  




TIC LPC support Intern

Location:Beijing

R-10031419

(上下滑动启阅)

Responsibilities:

• Provide highly technical support to customer around the world designing with LPC MCU products via email, phone, etc.

• Become the technical expert on LPC MCU products.

• Improve customer satisfaction by following up on client complaints.

• Collaborate with other teams to improve our offering enhancing our Customer’s experience.

• Enhance you technical knowledge participating in:

- Development/revision of documentation.

- Writing/reviewing Application Notes.

- Testing silicon modules and software drivers.

- Creating/providing trainings.

- Working on development projects.

- Reviewing SW/Schematics/Layouts from Customers.

 

Qualifications:

• Bachelor or Master’s Degree in Microelectronics, Electronics, Electrical Engineering, Computer Science or relevant disciplines.

• good coding skill, OS knowledge.

• Demonstrated strong analytical and problem solving skills, ability to work in teams and collaborate effectively with people in different functions.

• Strong written and verbal communication skills.



恩智浦祝大家新年快乐!


You want more than just a job? 

Build your career with NXP.

点一点告诉大家你也"在看" ↓

您可能也对以下帖子感兴趣

文章有问题?点此查看未经处理的缓存