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【JMAT征稿通知】柔性电子材料和器件

Doris 英文刊Materiomics 2022-10-02

好消息,好消息!JMAT面向广大学者征集有关"柔性电子材料和器件"的稿件啦。录用的稿件将发表在2020年1月的特刊上。



Special Issue on

“Flexible electronic materials and devices”


Summary and Scope

Flexible electronic materials and devices have attracted great attention due to their full advantage of both structural plasticity and multi-level integration. Examples of active flexible applications include flexible displays, flexible cell phones/computers/digital cameras, wearable healthcare monitoring, and other flexible electronic systems. Such materials include organic and inorganic forms for sensors and other devices with flexibility and multifunctional properties. A strong research activity in this field would therefore require deep understanding of the fundamentals of the subject, which are important for a wider scientific community comprised of materials scientists, physicists, chemists, technologists and engineers, from academia and industries.

   柔性电子材料和器件因为兼具结构可塑性和多层次集成的优点而广受关注,已用作柔性显示器,柔性手机/计算机/数码相机,可穿戴式医疗监控以及其他柔性电子系统。柔性电子材料包括用于传感器的有机和无机物以及具有柔性和多功能特性的其它器件。涉及该领域的研究需要深刻理解材料的基本理论,这对于来自学术界和工业界的材料科学家、物理学家、化学家、技术专家和工程师组成的广泛的科学界来说非常重要。

The Journal of Materiomics is a leading academic journal that publishes cutting-edge research in this particular field. The journal is planning a special issue (to be published in January, 2020) focused on the progress in flexible materials and devices.

The topics that the special issue will include, but not be limited to:

  • Fundamentals on design of flexible electronic materials and devices

  • Organic flexible electronic materials and devices

  • Inorganic flexible electronic materials and devices

  • Stretchable/wearable electronic devices

    特刊将包含但不局限于以下内容:

  • 设计柔性电子材料和器件的基础研究

  • 有机柔性电子材料和器件

  • 无机柔性电子材料和器件

  • 可拉伸/可穿戴的电子器件


怎么投稿?

Submission Guideline

Authors should prepare their manuscripts following the online submission page of Journal of Materiomics at http://www.journals.elsevier.com/journal-of-materiomics. All manuscripts will be peer-reviewed according to the journal reviewing procedures. 

 

Important Dates

Manuscript submission due date: 30 September, 2019

Publication date: 20 January, 2020

 

Guest Editors

1. Prof. Yuan Lin, The University of Electronic Science and Technology, China

E-mail: linyuan@uestc.edu.cn

2.  Prof. Quanxi Jia, University at Buffalo, USA

Email: qxjia@buffalo.edu

3. Prof. Hong Wang, Southern University of Science and Technology, China

Email: wangh6@sustc.edu.cn

4. Prof. Xuanhe Zhao, MIT, USA

 Email: zhaox@mit.edu

    

欢迎大家积极投稿,一展您的风采!

                                                 

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