十年磨一剑，电介质领域你不得不了解的期刊！

Original 电介质小助手电介质Dielectrics

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说起电介质，就不得不提到一个期刊，那就是《Journal of Advanced Dielectrics》，小编研究生期间多次拜读《Journal of Advanced Dielectrics》期刊上发表的论文，受益良多！今天我们就简单介绍下这个期刊以及上面发表的经典论文！

《Journal of Advanced Dielectrics》(简称JAD,中文名《先进电介质学报》)是由西安交通大学中国科学院院士、美国工程院外籍院士姚熹教授发起创办，新加坡世界科技出版集团(World Scientific Publishing Company)和西安交通大学国际电介质研究中心(International Center for Dielectric Research, Xi’an Jiaotong University)合作出版的英文国际学术期刊。JAD创刊号于2011年1月出版。

图1：期刊封面

JAD以先进电介质研究为特色，重点关注功能电介质学术研究及应用前沿，现面向国内外公开征集本领域高水平英文稿件。主题包括但不局限于电介质基础理论、模型、极化现象、介电弛豫、铁电材料与器件、压电材料与应用、热释电材料与应用、多铁性、电光和光电子材料、相变和结构表征、薄膜/厚膜与器件、能量收集与存储、微波毫米波电介质、纳米结构尺寸效应与表征、工程电介质与高压应用等方面。

JAD拥有一个国际化的编委会，由来自18个国家或地区的38位成员组成，他们全部是工作在科研前线的国际知名学者，专业范围涵盖了当前电介质研究领域的多数热点。期刊主编由国际知名铁电学家、中国科学院院士、美国工程院外籍院士姚熹教授担任，期刊副主编由俄罗斯、瑞士，日本、加拿大和新加坡等国国际本领域著名学者担任（编委名单详见文末）。

图2：期刊相关信息

接下来，我们将对《Journal of Advanced Dielectrics》期刊引用数量最多的九篇论文进行简单的介绍。这九篇论文对于电介质领域的研究人员来说，无疑是一本武功秘籍。看完这九篇论文你的功力定会大增，NS系列肯定指日可待!论文信息详见下图。

图3：《Journal of Advanced Dielectrics》引用数量最多的论文

图4：《Journal of Advanced Dielectrics》阅读数量最多的论文

A review on the dielectric materials for high energy-storage application

Xihong Hao

https://doi.org/10.1142/S2010135X13300016

Cited by:386

该篇论文由内蒙古科技大学郝喜红教授撰写，截止目前已被引用高达386次！文章对电介质储能材料的分类、储能特性计算方式、测试原理及储能特性的影响因素进行了详细而全面的介绍与阐述，并且基于现有的相关理论和实验结果对电介质储能材料的未来发展提供了展望，以期望推动电介质储能材料的实际应用。

图5：文中插图

The contribution of electrical conductivity, dielectric permittivity and domain switching in ferroelectric hysteresis loops

Haixue Yan, Fawad Inam, Giuseppe Viola, Huanpo Ning, Hongtao Zhang, Qinghui Jiang, Tao Zeng, Zhipeng Gao And Mike J Reece

https://doi.org/10.1142/S2010135X11000148

Cited by:206

该篇论文由英国伦敦大学玛丽女王学院晏海学教授撰写，截止目前已被引用高达206次！这篇论文以多种电介质材料为例详细的介绍了电导、介电常数及畴翻转对于电滞回线的影响。对于电介质研究方向的初学者来说这篇文章值得一读，全文写作通俗易懂，可以说是教材版的论文，极力推荐！

图6：文中插图

Dielectric relaxation in relaxor ferroelectrics

Alexei a. Bokov and Zuo-guang ye

https://doi.org/10.1142/S2010135X1241010X

Cited by:177

该篇论文由加拿大西蒙-菲舍尔大学化学系叶作光教授撰写，截止目前已被引用高达177次！该篇论文对弛豫铁电材料的介电弛豫的实验现象、理论模型、计算公式、内在机理等方面进行了详细且深入的阐述。

图7：文中插图

Lead-free piezoelectrics: Current status and perspectives

Indrani Coondoo, Neeraj Panwar and Andrei Kholkin

https://doi.org/10.1142/S2010135X13300028

Cited by:90

该篇论文由葡萄牙里斯本大学相关研究人员撰写，该篇论文从铅基压电陶瓷出发，系统且全面的对无铅压电材料的研究现状进行了总结且进行了多方面的展望。

图7：文中插图

Ferroelectric HfO2-based materials for next-generation ferroelectric memories

Zhen Fan, Jingsheng Chen and John Wang

https://doi.org/10.1142/S2010135X16300036

Cited by:50

该篇论文由华南师范大学樊贞副研究员撰写，主要介绍了下一代铁电存储用材料二氧化铪。全文简要回顾了基于HfO2铁电材料引起的热门话题，包括铁电的起源，优异的材料性能以及FeRAM中的当前研究现状及潜在应用。

图8：文中插图

今天就介绍到这里，最后希望大家多多支持国产期刊，支持电介质领域的发展，觉得这篇文章还不错的请随手转发吧！

Editorial Board

Editor-in-Chief

Xi Yao
Electronic Materials Research Laboratory (EMRL)
Xi\'an Jiaotong University, Xi\'an 710049, P.R. China
xyao@xjtu.edu.cn
Tel: +86-29-83395679
Fax: +86-29-83395679

Editors

Yongxiang Li
Shanghai Institute of Ceramics, Chinese Academy of Sciences
1295 Dingxi Road, Shanghai 200050, P.R. China
yxli@mail.sic.ac.cn

Cewen Nan
Department of Materials Science and Engineering
Tsinghua University, Beijing 100084, P.R. China
cwnan@tsinghua.edu.cn

Ahmad Safari

Gelenn Howatt Electroceramics Laboratories
Department of Materials Science and Engineering
Rutgers University, Piscataway, New Jersey, 08854, USA
safari@rci.rutgers.edu

Vladimir Ya. Shur
Ferroelectric Laboratory, School of Natural Sciences and Mathematics
Ural Federal University, 51 Lenin Ave., Ekaterinburg 620000, Russia
vladimir.shur@urfu.ru

Takaaki Tsurumi
Graduate School of Science and Engineering
Tokyo Institute of Technology
2-12-1 Ookayama, Meguro
Tokyo 152-8552, Japan
ttsurumi@ceram.titech.ac.jp

Xiaoyong Wei
Electronic Materials Research Laboratory (EMRL)
Xi\'an Jiaotong University, Xi\'an 710049, P.R. China
wdy@xjtu.edu.cn

Zuo-Guang Ye
Department of Chemistry
Simon Fraser University, Burnaby, B.C., V5A 1S6, Canada
zye@sfu.ca

Board Members

Miguel Algueró
Instituto de Ciencia de Materiales de Madrid (ICMM)
Consejo Superior de Investigaciones Científicas (CSIC)
Cantoblanco, Madrid 28049, Spain
malguero@icmm.csic.es

Jüras Banys
Department of Radiophysics
Vilnius University
Sauletekio 9, 10222 Vilnius, Lithuania
juras.banys@ff.vu.lt

Aimé Peláiz Barranco
Facultad de Física
Universidad de La Habana
San Lázaro y L, Vedado, La Habana 10400, Cuba
pelaiz@fisica.uh.cu

Nazanin Bassiri-Gharb
G.W. Woodruff School of Mechanical Engineering
School of Materials Science and Engineering
Georgia Institute of Technology
Atlanta, GA, 30332-0405, USA
nazanin.bassirigharb@me.gatech.edu

Alexei A. Bokov
Simon Fraser University
Burnaby, BC, V5A 1S6, Canada
abokov@sfu.ca

David Cann
School of Mechanical, Industrial, and Manufacturing Engineering
Oregon State University, Corvallis, OR 97331, USA
cann@oregonstate.edu

Long-Qing Chen
Materials Research Institute
The Pennsylvania State University
University Park, PA 16802-5005, USA
lqc3@psu.edu

Zhongyang Cheng
Materials Engineering
275 Wilmore Lab, Auburn University, AL 36849, USA
chengzh@eng.auburn.edu

Zhi-Min Dang
Department of Electrical Engineering
Tsinghua University, Beijing 100084, P.R. China
dangzm@tsinghua.edu.cn

Catherine Elissalde
Institute of Condensed Matter Chemistry of Bordeaux (ICMCB) - CNRS
87 Avenue du Docteur A. Schweitzer, 33608 Pessac cedex, France
elissald@icmcb-bordeaux.cnrs.fr

Hiroshi Funakubo
Department of Innovative and Engineered Materials
Interdisciplinary Graduate School of Science and Engineering
Tokyo Institute of Technology
4259 Nagatsuta-cho, Midori-ku, Yokohama, 226-8502, Japan
funakubo.h.aa@m.titech.ac.jp

Norifumi Fujimura
Physics and Electronics
Graduate School of Engineering
Osaka Prefecture University
fujim@pe.osakafu-u.ac.jp

Reimund Gerhard
Institute of Physics and Astronomy, Faculty of Science
University of Potsdam
Karl-Liebknecht-Str. 24-25
14476 Potsdam-Golm, Germany
reimund.gerhard@uni-potsdam.de

Xihong Hao
School of Materials and Metallurgy
Inner Mongolia University of Science and Technology
Baotou 014010, P.R. China
xhhao@imust.cn

Jiri Hlinka
Institute of Physics, The Czech Academy of Sciences
Na Slovance 2, 182 21 Prague 8, Czech Republic
hlinka@fzu.cz

Li Jin
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
ljin@mail.xjtu.edu.cn

Andrei Kholkin
Department of Physics and CICECO-Materials Institute of Aveiro, University of Aveiro
3810-193 Aveiro, Portugal
kholkin@ua.pt

Eung Soo Kim
Department of Materials Engineering
Kyonggi University
Suwon 443-760, Korea
eskim@kyonggi.ac.kr

Jae-Hyeon Ko
School of Nano Convergence Technology, Hallym University
1 Hallymdaehakgil, Chuncheon, Gangwondo 24252, Korea
hwangko@hallym.ac.kr

Ling Bing Kong
College of New Materials and New Energies
Shenzhen Technology University
3002 Lantian Road, Pingshan District, Shenzhen 518118, P.R. China
konglingbing@sztu.edu.cn

Jurij Koruza
Department of Materials and Earth Sciences
Technical University of Darmstadt
Alarich-Weiss-Straβe 2, 64287 Darmstadt, Germany
Koruza@ceramics.tu-darmstadt.de

Yoshihiro Kuroiwa
Graduate School of Advanced Science and Engineering
Hiroshima University
1-3-1 Kagamiyama, Higashihiroshima
Hiroshima 739-8526, Japan
kuroiwa@sci.hiroshima-u.ac.jp

Fei Li
Electronic Materials Research Laboratory (EMRL)
Xi’an Jiaotong University, Xi\'an 710049, P.R. China
ful5@xjtu.edu.cn

Guo-Rong Li
Shanghai Institute of Ceramics
Chinese Academy of Sciences
1295 Dingxi Road, Shanghai 200050, P.R. China
grli@sunm.shcnc.ac.cn

Jiangyu Li
Shenzhen Institute of Advanced Technology
Chinese Academy of Sciences
1068 Xueyuan Avenue
Shenzhen University Town, Shenzhen, P.R. China
jy.li1@siat.ac.cn

Yan-Rong Li
School of Electronic Science and Engineering
University of Electronics Science and Technology of China
No. 2006, Xiyuan Avenue, Chengdu 611731, P.R. China
yrli@uestc.edu.cn

Hanxing Liu
School of Materials Science and Engineering
Wuhan University of Technology
122 Luoshi Road, Wuhan 430070, P.R. China
lhxhp@whut.edu.cn

Ming Liu
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
mingliu@xjtu.edu.cn

Yun Liu
Research School of Chemistry
The Australian National University, ACT 2601, Australia
yun.liu@anu.edu.au

Zhifu Liu
Shanghai Institute of Ceramics
Chinese Academy of Sciences
585 Heshuo Road, Jiading District
Shanghai 201899, P.R. China
liuzf@mail.sic.ac.cn

Yuji Noguchi
Department of Applied Chemistry
School of Engineering
The University of Tokyo
7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
yuji19700126@gmail.com

Ivan A. Parinov
I. I. Vorovich Institute of Mathematics
Mechanics and Computer Science
Southern Federal University
Rostov-on-Don, Russia
parinov_ia@mail.ru

Yimnirun Rattikorn
School of Physics, Institute of Science
Suranaree University of Technology
Nakhon Ratchasima 30000, Thailand
rattikorn@sut.ac.th

Mike Reece

Eng 336, Department of Materials
Queen Mary, University of London
London E1 4NS, UK
m.j.reece@qmul.ac.uk

Krystian Roleder
Institute of Physics
University of Silesia in Katowice
ul. 75 Pułku Piechoty 1, 41-500 Chorzów, Poland
krystian.roleder@us.edu.pl

Wei Ren
Electronic Materials Research Laboratory (EMRL)
Xi\'an Jiaotong University, Xi\'an 710049, P.R. China
wren@xjtu.edu.cn

Tadej Rojac
Electronic Ceramics Department
Jožef Stefan Institute
Jamova cesta 39, 1000 Ljubljana, Slovenia
tadej.rojac@ijs.si

Xiaoli Tan
Materials Science and Engineering
Iowa State University
2240 Hoover Hall, 528 Bissell Road
Ames, IA 50011, USA
xtan@iastate.edu

R. P. Tandon
Department of Physics and Astrophysics
University of Delhi,
Delhi-110007, India
ram_tandon@hotmail.com

Chunlei Wang
School of Physics, Shandong University
27 South Shanda Road, Jinan 250100, P.R. China
wangcl@sdu.edu.cn

Ke Wang
School of Materials Science and Engineering
Tsinghua University, Beijing 100084, P.R. China
wang-ke@tsinghua.edu.cn

Di Wu
College of Engineering and Applied Sciences
Nanjing University, 22 Hankou Road
Nanjing 210093, P.R. China
diwu@nju.edu.cn

Jiagang Wu
College of Materials Science and Engineering
Sichuan University, Wangjiang Road 29
Chengdu 610064, P.R. China
nic0400@scu.edu.cn

Yugong Wu
School of Electronic and Information Engineering
Tianjin University, 92 Weijing Road, Tianjin 300072, P.R. China
wuyugong@tju.edu.cn

Kui Yao
Institute of Materials Research and Engineering
A*STAR (Agency for Science, Technology and Research)
2 Fusionopolis Way, Innovis, Singapore 138634
k-yao@imre.a-star.edu.sg

Yumeng You
School of Chemistry and Chemical Engineering
Southeast University, Jiangning District
Nanjing 211189, P.R. China
youyumeng@seu.edu.cn

Jiwei Zhai
Functional Materials Research Laboratory (FMRL)
Tongji University, 1239 Siping Road, Shanghai 200092, P.R. China
apzhai@mail.tongji.edu.cn

Haibo Zhang
School of Materials Science and Engineering
Huazhong University of Science and Technology
1037 Luoyu Road, Wuhan 430074, P.R. China
hbzhang@hust.edu.cn

Shujun Zhang
Institute for Superconducting and Electronic Materials
University of Wollongong
Northfields Ave Wollongong
NSW 2522, Australia
shujun@uow.edu.au

Di Zhou
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
zhoudi1220@xjtu.edu.cn

Jianguo Zhu
College of Materials Science and Engineering
Sichuan University, Wangjiang Road 29
Chengdu 610064, P.R. China
nic0400@scu.edu.cn

Managing Editors

Nan Zhang
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University
Xi'an 710049, P.R. China
nzhang1@xjtu.edu.cn

Jihui Gong
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University
Xi'an 710049, P.R. China
jad@xjtu.edu.cn
Tel: +86-29-83395679
Fax: +86-29-83395679

Editorial Team

Xiangyu Gao
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
gaoxiangyu@xjtu.edu.cn

Jingrui Li
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
jingrui.li@xjtu.edu.cn

Xingtian Yin
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
xt_yin@xjtu.edu.cn

Jie Zhang
Electronic Materials Research Laboratory (EMRL)
Xi'an Jiaotong University, Xi\'an 710049, P.R. China
jzhang12@xjtu.edu.cn

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