建筑结构丨2018年8月21-22日：第四届恢先地震工程青年学者国际论坛

INTERNATIONAL FORUM

4th Huixian International Forum on Earthquake Engineering for Young Researchers

 August 21-22, 2018  Shanghai

HuixianEarthquake Engineering Foundation

US-China Earthquake Engineering Foundation

Earthquake Resiliency Committee, Seismological Society of China

College of Civil Engineering, Tongji University

Journal of Building Structure, China

ANNOUNCEMENT

Background

The Huixian International Forum on Earthquake Engineering for Young Researchers was proposed jointly by the Huixian Earthquake Engineering Foundation and the US-China Earthquake Engineering Foundation, aiming at commemorating the pioneers in earthquake engineering and providing young researchers a platform for communication, knowledge sharing, and research collaboration. The first to third forum were held in Harbin (2014), Beijing (2016) and Illinois (2017). We extend the warmest welcome to all, and hope that you enjoy the 4th Huixian International Forum, in Shanghai.

Important Dates

Deadline for Abstract Submission: March 31, 2018

Acceptance Notification: April 15, 2018

Deadline for 6-Page Paper Submission: extended to July 15, 2018

Deadline for Hotel Booking: July 31, 2018

Registration: August 21, 2018

Huixian Forum: August 22, 2018

Paper and Information Submission

Email Address: [e-mail]

Themes

●  Observation and monitoring of strong ground motions

●  Ground response analysis

●  Seismic slope stability and liquefaction mitigation

●  Safety assessment of foundations

●  Seismic analysis methods and experimental techniques

●  Vibration monitoring and control

●  Seismic rehabilitation techniques

●  Seismic risk analysis and structural safety assessment

●  Seismic safety assessment of lifeline systems

●  Theories and methods of structural seismic design

●  Urban seismic disaster simulation, mitigation and emergency managemen

Keynote Speaker

Jonathan P.Stewart, University of California, Los Angeles, USA

Larry Fahnestock, University of Illinois at Urbana-Champaign, USA

Kentaro Tabata, E-Defense, National Research Institute for Earth Science and Disaster Resilience

Zhaodong Xu, Southeast University, China

Venue

The Forum will be hosted in Shanghai Fuyue Hotel, China. (208 Rongyue Road,Songjiang District, Shanghai.)

Language & Publication

English will be the official language in this forum.

Accepted papers will be included in the conference CDROM, which will be available at the beginning of the conference. The paper will not be published.

Registration Fees

Registration

Regular: ¥1000 or $150; Student:¥500 or $75

Scientific Committee

Davis A. Craig,Los Angeles Department of Water and Power

Ji Dang, Saitama University

Xiuli Du, Beijing University of Technology

Yuanfeng Duan, Zhejiang University

Ahmed Elgamal, University of California, San Diego

Larry A. Fahnestock, University of Illinois at Urbana-Champaign

Jiansheng Fan, Tsinghua University

Peng Feng, Tsinghua University

Gaston Fermandois-Cornejo, University of Illinois at Urbana-Champaign

Koehi Fujita, Kyoto University

Sachi Furukawa, Tohoku University

Anxin Guo, Harbin Institute of Technology

Tong Guo, Southeast University

Jianping Han, LanZhou University of Technology

Qiang Han, Beijing University of Technology

Hong Hao, Guangzhou University

Muneo Hori, University of Tokyo

Huanjun Jiang, Tongji University

Kazuhiko Kasai, Tokyo Institute of Technology

Masahiro Kurata, Kyoto University

Oren Lavan, Israel Institute of Technology

Taehyung Lee, Konkuk University

Gang Li, Dalian University of Technology

Hongnan Li, Shenyang Jianzhu University

Zhongxian Li, Tianjin University

Dimitrios Lignos, McGill University

Jiepeng Liu, Chongqing University

Dechun Lu, Beijing University of Technology

Xilin Lu, Tongji University

Xinzheng Lu, Tsinghua University

Zhaohui Lu, Central South University

Edoardo Marino, University of Catania

Jason Mccormick, University of Michigan

Gilberto Mosqueda, University of California, San Diego

Masayoshi Nakashima, Kyoto University

Narutoshi Nakata, Clarkson University

Taichiro Okazaki, Hokkaido University

Jinping Ou, Dalian University of Technology

Peng Pan, Tsinghua University

Bing Qu, California Polytechnic State University

Billie F. Spencer, University of Illinois at Urbana-Champaign

Jonathan P. Stewart, University of California, Los Angeles

Baitao Sun, Institute of Engineering Mechanics, CEA

Ping Tan, Guangzhou University

Zhong Tao, Kunming University of Technology

Jinting Wang, Tsinghua University

Tao Wang, Institute of Engineering Mechanics, China Earthquake Administration

Yan Xiao, Nanjing Technology University

Bin Xu, Hunan University

Longhe Xu, Beijing Jiaotong University

Tony Yang, University of British Columbia

Changhai Zhai, Harbin Institute of Technology

Bin Zhao, Tongji University

Mi Zhao, Beijing University of Technology

Xun Zhong, Hefei University of Technology

Ying Zhou, Tongji University

Yanguo Zhou, Zhejiang University

Haiyang Zhuang, Nanjing University of Technology

Degao Zou, Dalian University of Technology

Organizing Committee

Cheng Chen, San Francisco State University

Yumin Chen, Hohai University

Quan Gu, Xiamen University

Chunlin Hou, Nuclearand Radiation Safety Center

Ning Li, Tianjin University

Zhongcheng Li, China Nuclear Power Engineering Co. Ltd.

Zheng Lu, Tongji University

Qiang Ma, Institute of Engineering Mechanics, CEA

Yuchen Ou, National Taiwan University of Science and Technology

Yongbo Peng, Tongji University

Peixin Shi, Suzhou University

Liang Tang, Harbin Institute of Technology

Chunyu Tian, China Academy of Building Research

Gang Wang, Hong Kong University of Science and Technology

Yang Wang, University of Michigan

Junju Xie, Institute of Geophysics, CEA

Lu Yang, National Natural Science Foundation of China

Yong Yuan, Huazhong University of Science and Technology

Conference Co-Chairs

Prof. Ying ZHOU, Tongji University

Prof. Tao WANG, Institute of Engineering Mechanics, CEA

Prof. Bin ZHAO, Tongji University

For More Information

Contact: Prof. Zheng Lu ，Dingyan Wu

Email:[e-mail] ,[e-mail]

Mobile: [phone]

Website：http://www.buildingstructure.cn/Item/20019.aspx

Registration form: download here! (Please submit this form before July 15) 

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