社招 | 快来解锁2022全"芯"职位！

恩智浦微招聘 2022-09-18

“

新年新气象，新年“芯”职位。

小编在此送上2022年社招热招职位。

快来收获新年的第一份offer吧！

恩智浦期待你的加入！

如何申请？

申请方式①

将简历投递至：China.Talent@nxp.com

邮件注明：姓名+申请职位+工作城市

申请方式②

点击文末"阅读全文"，

找到职位，输入职位编号(R-100*****)

进行申请！

社招职位

Principal Product Marketer-5G EDGE

Location：Beijing

R-10029912

(上下滑动启阅)

Responsibilities:

• Lead analysis and solution development to drive new growth opportunities across a dynamic and innovative business environment comprised of wide range of service provider, OEM, ODM, Software development and integration entities.

• Leverage critical thinking & sharp problem-solving skills to support the design & execution of new solutions.

• Support and accelerate execution of strategic initiatives, working alongside leaders to ensure effective implementation, governance, communication and change management.

• Structure and lead proof-of-concept and/or pilot engagements with technology and business partners.

• Drive collaboration and manage ecosystem (SW & HW) partners

• Interfaces to ODMs, System integrators to drive acceptance of solutions from NXP

• Coach junior members of the team to enhance their personal effectiveness & ability to make a positive impact.

Qualifications:

• Bachelor’s degree in Electrical, Computer Engineering, Computer Science.

• Master’s degree in a related subject or in marketing/business is a plus.

• Wireless 3GPP knowledge.

• Familiarity with at least one of the following: network communications, processor architecture, embedded software, wireless technologies.

• Prior systems engineering experience also a plus.

• Strong preference for networking experience (routing, switching, datacenter, wireless infrastructure) and related communications protocols.

• Strong understanding of SoC principles and components (memory interfaces, CPU architectures, USB, PCIe, SATA, etc).

Principal Test Engineer

Location：Shanghai

R-10028892

(上下滑动启阅)

Responsibilities:

• Responsible for the design and development of test solution in terms of hardware design and software coding for product functional test in factory.

Understand test specification and requirement given by design and manufacturing team, and analyzed product features to proposal the test coverage, as well as design the test system.

• Capable in understanding product design schematics and circuit diagram, and identify / proposed measurement points and test points with design and PCB CAD team.

• Identify and select suitable test equipment for product electrical measurement..

• Ability to design electronic circuit and source for electronics components for use to interface with product during testing.

• Perform test software coding or code development to drive test equipment, product-firmware interface, test result data-log, and fixture software control.

• Brainstorm and provide ideas, suggestions and solution to the various approach of testing a product.

• Design and work with contract manufacturer to designing test fixture & jigs to support the production.

• Participate in peer reviews of test engineering to improve hardware test process and efficiency across the Board Solutions Group.

• Conduct research into new technology and methodology for consistent measurement of a product feature.

• Work cross functionally to ensure the resolution of problems and actions as needed.

• Ability to work independently, resolve technical and manufacturing issues without detailed direction, and work as part of a team.

• Ability to work within strict deadlines.

• Capability to accurately and efficiently work on multiple projects.

Qualifications:

• Master or Bachelor’s degree in electronics(EE), product & industrial design, or related filed.

• Test and measurement instrumentation exposure and experience in software development for remote equipment control is required.

• Knowledge in EMC rules, like FCC/CE, will be an advantage.

• Possess software coding experience. C, C++, Python, Linux, Android and script programming skill. Experience with NI Labview is a plus.

• Prior experience with CPLD/FPGAs in implementing advanced HW control / monitoring / logging is highly desirable.

• Good technical and analytical skill with ability to perform electronic system debug effectively.

• Experience in digital networking manufacturing test development, power meter, RF and wireless test development, Touchpad/Touch-screen device test development will be an extreme advantage.

• Knowledge in micro-Controller programming, Android, Linux programming will be an advantage.

• Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated.

Senior Software Engineer - Wireless

Location: Shanghai

R-10034510

(上下滑动启阅)

Responsibilities:

• Develop Wi-Fi, Bluetooth and 15.4 device driver and firmware for NXP wireless SoCs.

• Develop Wi-Fi/BT/BLE/15.4 Coexistence software for NXP wireless SoCs.

• Develop system software and applications to enable advanced features by utilizing NXP Wi-Fi/Bluetooth/15.4 technologies.

• Study the latest Wi-Fi/BT/15.4 standard and develop the new features.

• Work on system integration and performance tuning on reference and customer platforms with various OS, including Android, Linux, Windows and RTOS etc.

• Support customers to address the critical issues for projects delivery.

Qualifications:

• Master or Bachelor’s degree in electronic engineering.

• Fluent in English (spoken and written) is required.

• Experience with C programming and debugging is required.

• Knowledge of TCP/IP is required.

• Knowledge of SDIO/USB/PCIE is preferred.

• Knowledge of Wi-Fi/Bluetooth/15.4 is preferred.

• Experience with Linux kernel, RTOS and driver development is preferred.

• Experience with firmware development on embedded system is preferred.

System Architect Battery Management

Location：Shanghai

R-10031882

(上下滑动启阅)

Responsibilities:

• Creation of functional requirements definition based on the China market and customer requirements.

• Requirement analysis, generation of concepts and documentation.

• Benchmark of different architectures and design space exploration to find the best performance, power and die size fit.

• Translating high level system requirements to a chain of smaller building blocks.

• Secure optimal specification set for the product in alignment with existing capabilities (IP, resources, target timeline, …).

• Technical leadership of the product definition process.

• Support product design-in for key customers.

• Strong collaboration with the system architecture team, the digital and analog design team as well as with the application engineering teams throughout the whole development cycle.

• Definition of verification requirements according to China specific automotive standards.

Qualifications:

• Bachelor or Master of Science in Electrical or Electronics engineering, Physics, or related discipline.

• 7+ years of experience within product definition, design or similar in industrial or automotive semiconductor applications.

• Strong analytical skills to understand, model, and analyze electronic circuits and systems to propose breakthrough semiconductor solutions.

• Excellent communication skills both written and spoken in Mandarin and English as well as good cultural awareness.

Your Experience:

• Expert knowledge and demonstrated experience in automotive BMS systems.

• Prior experience working at Automotive Tier 1 or 2 supplier in defining, implementing, or supporting Battery Management Systems is desired.

• Knowledgeable about automotive quality (AEC-100) and reliability requirements, safety analysis methods (FMEA, FTA) and familiar with functional safety standards such as ISO26262 is desired.

• Team and people skills for an international and intercultural environment, self-driven attitude to get engaged and contribute.

• Open to travel for customer meetings and internal team meetings up to 20% of the time.

Principal Digital Design Engineer

Location：Shanghai

R-10032758

(上下滑动启阅)

Responsibilities:

• You will be responsible for the digital design of IP modules, IP subsystems, and/or for the SoC top level integration for security-certified microcontrollers:

• Architectural specification of IP modules, IP subsystems and SoC top level for highly secure microcontroller SoC’s.

• RTL design and verification of digital IP modules: Responsible for the implementation of your IP modules, overseeing the module-level verification in close cooperation with the verification team, and debugging failing test cases on module level and SoC top level.

• Power-aware RTL design and power-optimization for contactless devices.

• SOC level performance optimization.

• Contribute to system architecture reviews and SoC design reviews,

and conduct peer reviews on the designs of other designers.

• Synthesis: deliver a timing clean design with reliable constraints.

• RTL quality checks: provide reports and waivers for LEC, LINT, and CDC checks.

• Contribute to the post-silicon validation of SOC’s and IP Subsystems.

• Lead and mentor other engineers in the team, apply state-of-the-art design methodologies.

• Take the lead in analyzing and solving IP- and system level issues until resolution and closure.

Qualifications:

• Master or Bachelor’s degree in Electrical Engineering or Computer Science.

• At least 8 years of experience of hands on RTL design of SOC products.

• Solid understanding of microcontroller architectures (ARM / RISC-V preferred)

• Working experience in advanced verification methodologies, synthesis, revision control.

• Knowledge of secure microcontroller / smart card architectures is beneficial, but not a must.

• Quality-minded, result oriented.

• Must have expert problem solving skills.

• Crisp and concise communication skills (both verbal and written) are required.

Personal Traits:

• Rigorous and methodical with strong analytical skills.

• Flexible and adaptable with an ability to verify and debug on different platforms and abstraction levels.

• Tenacity in tracing and finding problems, with attention to detail.

• Ability to question and identify weaknesses in specifications, tool environments, etc.

• Good team player with ability to work across functional teams, sites, and cultures.

Senior FAE- Wifi

Location：Shanghai

R-10029027

(上下滑动启阅)

Responsibilities:

• The candidate will be an FAE supporting NXP’s wireless and connectivity solutions.

• You drive demand creation and design-in activity at customer sites in close cooperation with the NXP business lines; you provide technical skills & support to NXP’s sales staff and will work with the NXP technical community about technical issues and future roadmap of your customer.

• Working closely with sales, marketing to promote NXP Wi-Fi and Bluetooth product & corresponding vertical solutions to customer

• Major technical window to customer, provide project management to ensure customer project success.

• Provide technical supporting for product benchmarking, identifying and clarifying any technical issues of customer product design.

Qualifications:

• Master of electrical engineering, computing science or relevant disciplines

• At least three years working experience in Wi-Fi and Bluetooth connectivity area

Strong software skills, better to have experience in wireless gateway products software design.

• Experience on Linux programming experience, kernel and driver experience is plus.

• Knowledge of operating system, Linux/Android Kernel and BSP programming.

• Knowledge of wifi RF performance calibration.

• Good communication skills internally and externally, strong learning skill is a must.

Senior Secure IoT Firmware Engineer

Location：Shanghai

R-10033904

(上下滑动启阅)

Responsibilities:

• Work on the state-of-the-art technologies in industry-leading security and IoT products.

• Involve in multisite, multidisciplinary and multicultural projects with the global teams.

• Develop security certified products in the well-respected security certified environment.

• Define the feature requirements and firmware specification with cross functional teams.

• Design, implement and integrate the firmware modules to meet challenging demands.

• Develop creative ideas and software countermeasures for security threats and attacks.

• Optimize under limited resource usage, low power consumption, and security constrains.

• Implement and extend test suites to ensure a quality delivery of the full-fledged firmware.

• Create and review the design and implementation documents by international standards.

• Support both internal stakeholders and external customers at expert level.

Qualifications:

• Bachelor/Master degree in electrical/electronic engineering, computer science, information technology or relevant disciplines.

• Minimum 3 years’ experience in embedded software development with 8/16/32-bit MCU architectures (e.g. RISC-V, ARM-Cortex).

• Excellent programming and debugging skills in C/C++/C#, assembly and Python languages.

• Solid low-level development experience with GCC/LLVM compiler and ELF file format.

• Proficiency in verification methodologies and automated scripts by Jenkins and FPGA.

• Experience in agile software development process and configuration management tools.

• Knowledge of crypto algorithms and security certification would be an added advantage.

• Enthusiastic, self-motivated, fast learning and ability to deliver under pressure.

• Good command of English, both written and spoken.

Senior Supplier Quality Development Engineer

Location：Shanghai

R-10031974

(上下滑动启阅)

Responsibilities:

• Engage in development activities working with cross-functional product team in understanding and resolving technical issues and highlighting quality risks to core teams and management.

• Be responsible for Si substrate supplier development and quality manufacturing.

• Support the design and development of technically complex manufacturing process to enable new product designs and functional requirement.

Qualifications:

• Bachelor’s degree in Engineering or equivalent practical experience.

• 6+ years of experience with the advance substrate manufacturing process, supplier quality or equivalent.

• Experience/ knowledge in the follow technology: Si wafer substrate manufacturing process such as EPI wafer, Polish wafer, GaN …etc.

• Expert audit experience of supply chain and semiconductors materials suppliers. Certified auditor in ISO/IATF and other automotive standards will be an added advantage.

Preferred Qualifications:

• Strong Knowledge of common Si wafer substrate and Foundry process.

• Demonstrated record of strong problem solving skill with 6-sigma, DOE’s and static analysis tools such as Minitab, and/ or JMP.

• Ability to proactively influence the product design process by proposing DFx improvement with associated data.

• Comfortable working both independently and as a team player in a globally distributed team. Ability to actively participate in complex technical discussions.

• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule.

Senior Field Quality Engineer

Location：Shenzhen

R-10030795

(上下滑动启阅)

Responsibilities:

• Full ownership of the assigned Customers in terms of achieving the FQE specific targets

• Be the Customer quality advocate for the assigned Customers.

• Drive a positive Customer perception of NXP's Quality.

• Execute the CQC reduction plan for the assigned Customers.

enable Customer engineers / technicians to perform an effective initial evaluation of NXP device.

• Assist the Customer in the resolution of Customer caused issues (e.g. ESD/EOS protection, parts programming, etc.)

• Applying a diligent CQC data analysis for every return reported by the Customer to fully understand the device history.

• Identify any repeat occurrences possibly during FFV (field failure verification) and data mining.

• Responsible for acquisition, implementation and maintenance of the required tools to ensure excellent FFV capability.

Qualifications:

• Full ownership of the assigned Customers in terms of achieving the FQE specific targets.

• Be the Customer quality advocate for the assigned Customers.

• Drive a positive Customer perception of NXP's Qualit.

• Execute the CQC reduction plan for the assigned Customers.

SoC Design Engineer

Location：Suzhou

R-10029844

(上下滑动启阅)

Responsibilities:

• Main responsibility on SoC design for MCU/MPU with security and connectivity, which targets IoT/Edge/Auto application.

• Responsibility to design subsystem and top logic/integration for SoC.

• Responsibility on quality of SoC design with quality check flow, such as LINT/CDC/RDC/CLP.

• Support IP design and SoC verification.

• Work closely with other function teams on architecture definition as well as power/timing analysis.

• Join design methodology innovation for application.

Qualifications:

• Master or Bachelor’s degree in Microelectronics, electronic engineering, computer science or relevant disciplines.

• Experience on design or verification with Verilog/SV/VHDL.

• Understand SoC digital design and verification flow.

• Excellent problem analyzing/solving skills. Good collaboration skillset to support global projects. Hard working and team player.

• Good knowledge in C language, Verilog/VHDL/System Verilog.

• Nice to have knowledge of script language (ex. Perl/TCL/Python).

• Nice to have know-how of ARM or AMBA system.

Lab Validation Engineer on Electrification

Location：Tianjin

R-10032954

(上下滑动启阅)

Responsibilities:

• Support customers and design-in opportunities with testing and troubleshooting skills, manage communication in the customer interfacing.

• Perform validation testing on analog, mixed-signal and power chips, and Application HW&SW on bench, in cooperation with IC designers or System Engineers.

• Manage NPI Characterization project and be the owner of IC/System Validation plan, as global team sharing, planning, review and communication.

• Develop HW&SW evaluation kit for testing target.

Qualifications:

• Bachelor’s degree or above on Electronics/Circuit/System, Master preferred.

• Good knowledge on analog electronics.

• Knowledge and Skills on IC/System testing and validation, with hands-on experience on bench testing instruments.

• Skills and experience on HW development, as schematics, PCB layout, troubleshooting.

Skills and experience on coding, as C or Assembly on microcontroller/FPGA, LabView/LabWindows GUI on PC.

• Fluent English listening, writing and speaking, CET-6 preferred.

• Interest on technical details is admired, and experience on electronics system or IC design is preferred.

• Good teamwork spirit.

Product/Test Engineer

Location：Tianjin

R-10030685

(上下滑动启阅)

Responsibilities:

• Support new product development and ramp up, gross margin improvement and change management projects.

• Manage product yield improvement, zero defect implementation (PAT, SBL, JVT…) , manufacturing sustaining including supply assurance support.

• CQI investigations (ATE test, lab analysis and FA follow up) and customer communication.

• Perform and coordinate Electrical test, Failure verification, Failure Analysis and Risk assessment on the products.

• Bench characterization per request.

• Qual plan definition and qualification handling: reliability tests, ESD, Latch-up, etc.

• Evaluate and optimize product test coverage and DFx.

• Prepare documents, regular project report, CAB presentation and PPAP.

Qualifications:

• Bachelor’s degree or above in Electrical Engineering.

• Strong Analog Electronics competences with power device and automotive environment knowledge preferred.

• Test instrumentation operation skill.

• Basic statistical knowledge, while having experience on SPC(Statistic Process Control) is a plus.

• Good command of English both in writing and speaking in a global working environment

• Strong synthesis and logic analysis skills.

• Good teamwork.

• Hard working and diligent.

Systems and Application Engineer on Functional Safety

Location：Tianjin

R-10032955

(上下滑动启阅)

Responsibilities:

• Promote existing product portfolio to potential new customers in order to grow market share, defining product derivatives when appropriate and providing guidance in their system architecture to match products performance.

• Support existing customers in helping them solve application and system specific issues that they may encounter during the lifetime of the product.

• Develop product demonstration kit, models and system solution for end customers, based on in-depth knowledge of Battery Management System and embedded systems.

• Work with customers, field sales, FAEs, product definers, design engineers and the product line manager to support a family of power products for the business unit to plan roadmaps, specify new products and secure design wins.

• Perform requirements analysis and tradeoffs, create system level requirements descriptions, and work with product definers to create product specifications. Perform deep competitive analysis and provide plans and directions to drive market based solutions.

• Create customer facing technical documents such as data sheets, application notes, contributed articles and conference papers and contribute to reference designs and demos.

Qualifications:

• Must have a BSEE (Masters preferred) and in-depth knowledge over System architecture and IC components.

• Skills and experience on customer interfacing and market exploration with sense of urgency. Industry experience in Energy Storage System, Battery Management System, Inverter or Power Electronics etc.

• Good academic background is admired, as R&D project experience and professional articles publications.

• Excellent communications skills, verbal and written. Fluent English is admired.

• Specific skillset and knowledge, including electronics HW&SW design, Testing, Functional Safety or EMC optimization.

Design Quality - Verification Engineer Lead

Location：Tianjin

R-10032285

(上下滑动启阅)

Responsibilities:

• The Verification Engineer is part of the Design Quality team responsible for design support of products currently in production. Focus is on the analysis and debug of customer issues to determine root cause of functional verification test coverage gaps. Responsibilities encompass the enhancement of functional verification test benches, debugging failures, and assessing and implementing new functional test patterns to improve quality test coverage in existing production devices. A “zero-defect” mindset is a key enabler.

Qualifications:

• 10+ years in functional verification.

• Test pattern debugging and testing for verification and automatic testers.

• C/C++/Assembly Language Programming skills in ARM A/R/M series.

• VHDL/Verilog/System Verilog.

Senior SoC implementation Engineer

Location：Tianjin

R-10034720

(上下滑动启阅)

Responsibilities:

• High performance Micro Processor Synthesis and Static Timing Analysis.

• Padring design, Floorplan, Place&Route and physical verification.

• Power integrity analysis.

• Drive innovative ideas within function and collaborate with local and world-wide functional teams.

Qualifications:

• Bachelor’s degree or above in Micro Electronics or equivalent.

• 5+ years SoC implementation experience in production tape-outs.

• Deep knowledge in semiconductor process technology, digital circuit and SoC implementation methodology.

• Good listen, write and spoken English.

• Enthusiastic, creative, motivated and collaborative.

Facility Engineer

Location：Tianjin

R-10024436

(上下滑动启阅)

Responsibilities:

• Learn and execute tasks in leading-edge SoC product design.

• Work among full SoC implementation scope, from synthesis all the way to tape-out.

• Learn the technical challenges and make innovations to address them with access to our technical platform.

Qualifications:

• Bachelor/Master college students, major in micro-electronics, computer science or relevant disciplines.

• Highly interested in SoC hardware design and set it as target career.

• Enthusiasm, good communication.

• Minimum bandwidth is 4 day/week for 6 months.

Failure Analysis Engineer

Location: Tianjin

R-10031587

(上下滑动启阅)

Responsibilities:

• Failure Analysis Engineer will be responsible for analyzing the problem IC to find the root cause of failure, such as customer application problem, wafer manufacture defect, assembly package issue, etc.

• A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem. An in-depth understanding Analog and digital circuits are required. The devices analyzed include new designs/products, low yield on existing products, qualification failures, and returns from customers.

• The successful candidate will reproduce electrical failures in a lab environment and locate/characterize defect or anomaly using a variety of electrical, optical, and physical techniques. Collaboration is expected with experts within the FA lab and other organizations, e.g., Design, Test, and Manufacturing. FA results will be documented in formal failure analysis reports. Analysis techniques will involve a range of approaches including: rigorous analysis of the device on evaluation boards (EVBs), detailed in-circuit probing to examine signal behavior deprocessing of the packaged device in order to identify the cause of failure. In addition many advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), EMMI and Laser Induced Electrical Stimulation tools (e.g. OBIRCH) are used in the investigation, isolation and identification of problems.

Qualifications:

• Master Degree in Electrical Engineering Science.

• Demonstrated data analysis and problem solving skills.

• Ability to resolve complex customer issues and lead cross-functional teams.

• Strong English written and verbal communication and presentation skills and ability to influence others.

• Process control and other six sigma tools knowledge.

• Flexibility to adjust to change and multiple ongoing issues in a fast-paced, customer-focused environment.

• Ability to work independent of management with leadership skills.

Packaging Engineer

Location：Tianjin

R-10026802/R-10025483/R-10034760

(上下滑动启阅)

Responsibilities:

• Focusing on Flip Chip package process development.

• Define and validate package designs, materials and processes used for development of new products for NXP. Develop DOE’s and tests to evaluate suitability and reliability of package solutions.

• To provide technical solution in engineering to achieve yield, quality, cycle time and productivity goals.

• Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).

• Address and solve materials and processing issues that may occur during the development process.

Qualifications:

• Bachelor or Master degree in Engineering (Mechanical Engineering, Automation Engineering or Chemical Engineering, etc).

• 3+ years of Flip Chip package/process development work experience is highly preferred.

• CET-6 equivalent or above is preferred.

• Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.

• Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.

• Knowledge of Statistical Analysis and Design of Experiment is a plus.

• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.