OCP EMEA区域峰会技术资料分享（Prague, Czech）
这次我分享的不是OCP全球峰会的资料，而是今年的2023 EMEA区域峰会，4月19-20日，在东欧美丽的历史文化名城——捷克共和国首都布拉格举办。
本想简单讨论一两个技术话题，无奈周末事情有点多，还是先把资料发出来吧。
2023 OCP Regional Summit演讲资料网盘分享
https://pan.baidu.com/s/1kcgEUp9iDKLGYxhZN0hm9g?pwd=9ox7
提取码：9ox7
官网来源 https://www.opencompute.org/events/past-events/2023-ocp-regional-summit（内含视频链接，qiang外的）
议题如下：
Keynotes
Welcome to the 2023 OCP Regional Summit |
Empowering Open EMEA |
Driving Change through Collaboration: Meta’s Path to Net Zero Emissions |
Will Open Source Fail? |
Ethernet Fabric for High Performance Computing and AI/ML workloads |
Quantum Computing: What, Why, and What for |
Practical Quantum Computing: Telecom Usecase |
Sustainable Data Centers start with Efficient Computing |
AWS Taps OCP for Edge Computing |
Sustainable Data Centers and our Opportunity to Drive Net-Zero at Scale |
Panel: Cross-Organizational Sustainability Collaboration |
Future Technologies Symposium
OCP FTS Kick off & Opening Keynote "The AI Revolution is Upon Us: HPC Implications" |
Quantum-accelerated Supercomputing |
Putting the "work" in network: In-network stream data analytics |
Energy Efficient AI Hardware: neuromorphic circuits and tools |
Could Energy Aware Runtime (EAR) be the European bet for AI/HPC Data Center energy optimization? |
"Hot IT" a false economy? The true impact of temperature and location on efficiency |
Panel: Heat Reuse: Boiler Possibilities |
Cloud infrastructure: It has to work, and it has to be sustainable ... Surely this is not impossible! |
Kickoff FTS Technology Demonstrations |
FTS Technology Demonstrations |
Executive Talks
How OCP Technology can help to deploy the Edge and Core Cloud infrastructure |
New Generation Offering - Bracing the OCP Ecosystem |
GIGA COMPUTING Technology: Spun-off for New Generation |
Directly Lower Carbon Emissions and get to Net-Zero using Cloud Native Processing |
The next generation of efficient compute for Service Providers |
Democratizing Networking |
Let's put the Open back into Open System Firmware |
Murata Powering Open Compute Forward |
Sustainable and Secure - It's EPYC |
SONiC Workshop
How to go superSONiC with Your Network Infrastructure! |
DT Implementing SONiC Architecture within Multi VRF Datacenters |
Monitoring and Telemetry |
Leveraging Silicon Enabled Observability with Open Source Collector |
Not again, something new? Getting started with Open networking and SONiC |
Gitops for Networking - Orchestration at Scale |
Increasing Network Reliability using Dual TOR with Credo HiWire SWITCH AEC and Sonic |
EW: Chiplets
扩展阅读：《多Die封装：Chiplet小芯片的研究报告》（Winnie Shao博士大作）
《HiPChips Chiplet Workshop @ ISCA 2022会议资料》
Building an Open Chiplet Economy |
Chiplets for addressing Challenges and Use cases for AI and ML applications |
Seeding an Open Chiplet Ecosystem |
A Chiplet Reference Platform Utilizing OCP Bunch-of-Wires |
Known Good Die (KGD) for Chiplet Based Heterogenous Integration |
A Chiplet based SmartNIC Platform using Bunch-of-Wires |
Revolutionizing Interconnect Performance and Reliability Monitoring in a Chiplet based System-In-Package |
Securing System-in-Packages with Physical Unclonable Functions (PUF) Technology |
EW: Deployments
Is it a waste of time to try to build an efficient cloud? |
OpenBMC port to RL300 a CSP/vendor perspective |
Open Networking Enables Deutsche Telekom to Sail the Cloud Native Seas |
Building a regional infrastructure as a service (IaaS) Cloud using Open Compute Platforms |
Open Process: digital resiliency in the age of Splinternet |
Most Sustainable OCP Modular Data Center (MDC) in Denmark |
EW: Edge（边缘）
Edge data center use case for 5G ORAN |
Direct liquid cooling for Open Edge servers - Viability study |
Architecture options Cloud RAN vDU |
3rd generation OpenEdge Server design |
How Datacenters can be more Efficient |
Simpler PTP: Optimized Precision Time Protocol (PTP) for Datacenters |
A SONiC-based Open Packet Broker for 5G Monitoring |
AT&T enables Large Scale SONiC Deployment |
End-2-End Open LAN Architecture |
EW: Facility
Introduction to Modular Data Centers for OCP Deployment & OCP Workstream |
Densifying Modular Data Centers With Hybrid Cooling |
Modular Data Center Scope 3 Emissions Cross Laminated Timber (CLT) vs Steel |
Google Implementation of the Open Rack Frame V3 Specification - Deep Rack |
Meta Open Rack Frame V3 Specification |
Efficiency Improvements and Other Developments in ORv3 Power Solutions |
EW: Hardware Management（硬件管理）
Data Center Secure Control Module (DC-SCM) 2.0 Compliance Testing with OpenBMC |
PCI Express HW Fault Management (RAS) Solution Implementation considerations in Meta's AI/ML Training Clusters |
Industry SMBus to I3C Transition Readiness Proven |
OSF for Intel Xeon-SP at Your Fingertip |
Empowering the Industry with Open System Firmware |
OCP - OSFCI @ scale - save our co-lo bills (and the planet) ! |
EW: IT Ecosystem: Networking（网络）
Livin’ On The Edge of Open Networking |
Scaling Remote direct memory access (RDMA) networks for AI Training |
Test tooling for 100% of SAI use cases |
Extending SAI support to Linux Based Ethernet Switch for Enterprise Networking |
SONiC Lite: How to fit SONiC into a "small" box |
Toward SONiC-based Network Infrastructure: Migration Best Practices |
Is SONiC ready for enterprise environments? |
Accelerating infrastructure with Data Processing Units (DPU) |
EW: IT Ecosystem: Server & Storage（服务器和存储）
Disentangling your data center with the OpenFabrics Management Framework |
The Next Evolution of Meta’s Compute Server Platform with Crater Lake, Yosemite V3.5, and Open Rack V3 |
AI as one of your developers - ChatGPT3 vs Datacenter NVMe® SSD requirements |
An overview of CXL Memory expansion module Error Handling (RAS) Solution Implementation for better reliability |
Ampere® Altra® Family Mt. Bonnell - Compelling Performance for a Carbon Neutral Future |
Open Accelerator Infrastructure (OAI) Workstream Update on 112Gbps Signal Integrity Assessment |
High-speed IO Trends for Hyperscale: Innovation Opportunities |
Data Center Modular Hardware System (DC-MHS) Overview & Update |
EW: Security（安全）
Systemization of Knowledge: Attestation in Confidential Computing |
Secure System Design on Arm using Platform Root of Trust (PRoT) |
An Update on Caliptra |
Platform Attestation via Redfish |
OCP Standards for Third Party Security Reviews of ROM and Firmware |
OCP Flashless Boot Specification |
EW: Sustainability: Cooling Environments（制冷环境）
Immersion Community Update |
Immersion-Hurdles update |
Immersion-Power Distribution |
Immersion Fluid Specification |
Immersion-Signal Integrity |
Immersion-Requirements |
Panel: Coolant Temperatures for Durable Data Center Designs |
Advanced Cooling Facilities Piping System Guideline - Status Update |
ACS Door HX Sub-Project Update |
Compute and thermal performance of repurposed OCP hardware from air to liquid |
Latest revision of the Cold Plate Cooling Loop Requirements |
Loop Heat Pipe for Modular Data Centes |
EW: Sustainability: Heat Reuse/Circular（热重用/循环）
Panel: Heat Reuse from an operator point of view |
OCP, energy, data centres and society: new applications and metrics |
Quantifying Data Center Scope 3 Carbon Emissions |
Sharpening Our Pencils on Carbon Measurement |
Circular Economy for the Data Centre Industry (CEDaCI) - dispelling myths about and accelerating a Circular Economy for the Data Centre Industry |
Redeploying Data Center Hardware to Mitigate Hardware Scarcity |
How OCP is Disaggregating Industry Structure and Advancing Sustainability |
Operating on Carbon Free Energy, 24/7 |
附：部分往届峰会资料
《2022 OCP Global Summit会议资料分享》
《2021 OCP Global Summit会议资料下载分享》
《2019 OCP Global Summit会议资料下载 - Part 3》
《2019 OCP Global Summit会议资料下载 - Part 1》
注：本文只代表作者个人观点，与任何组织机构无关，如有错误和不足之处欢迎在留言中批评指正。进一步交流可加微信：490834312。如果您想在这个公众号上分享自己的技术干货，也欢迎联系我：）
感谢您的阅读和支持！《企业存储技术》微信公众号：HL_Storage
长按二维码可直接识别关注
历史文章汇总：http://www.toutiao.com/c/user/5821930387/
http://www.zhihu.com/column/huangliang