专题征稿：激光微纳制造 | Engineering

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Call for Papers

Special Issue on Laser Micro/Nano-Manufacturing

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Deadline for Paper Submission: 

December 31, 2023

Laser micro/nano engineering stands as a fundamental pillar underlying numerous cutting-edge technologies. In recent decades, significant advancements have unfolded in this domain, spanning theoretical foundations, technological progress, and practical engineering applications. The significance of laser micro/nano engineering resides in its unparalleled capacity to manipulate materials at small scales, while maintaining an exceptional degree of precision. This capability empowers the creation of intricate structures critical to modern electronics, communication systems, and healthcare devices, including microchips, sensors, and medical apparatus. Laser-based techniques embody non-contact and non-invasive processes, minimizing potential harm to delicate materials. Consequently, they facilitate swift prototyping, tailored fabrication, and efficient manufacturing, yielding cost reductions and heightened productivity. By stimulating innovation and fostering breakthroughs across diverse industries, laser micro/nano engineering serves as a catalyst for augmented performance, miniaturization, and seamless integration within complex systems.

This special issue aims at gathering the newest global research achievements, focusing on the perspectives of fundamental theories, enabling technologies, and engineering applications. Thereby, the special issue will guide and accelerate the research of Laser Micro/Nano-Manufacturing. The topics of interest include, but are not limited to:

• Laser fabrication

• Laser surface modification

• Nano-material production

• Ultrafast laser related

• Metasurface/metamaterial

• Advanced nonlinear materials

Submission Guidelines

Only original manuscripts can be submitted, according to the “Guide for Authors” published on the Engineering website: 

https://www.journals.elsevier.com/engineering 

In regards to the online submission system of Engineering, the authors are invited to follow the link “Submit your Paper”, located in the main page of the Journal website, and submit manuscript to Article Type “SI: Laser Micro/Nano-Manufacturing” in Engineering.

Please mention the name of the Special Issue in your cover letter. All manuscripts will be peer-reviewed in accordance with the established policies and procedures of the journal. The final papers will be selected for publication depending on the results of the peer review process and the reviews of the Guest Editors.

Guest editors

Special Issue Editor-in-Chief

Minghui Hong, Xiamen University, China

Executive Editors-in-Chief

Tun Cao, Dalian University of Technology, China

Lianwei Chen, Institute of Optics and Electronics, Chinese Academy of Science, China

Special Issue Editorial Board

Baohua Jia, RMIT University, Australia

Mohsen Rahmani, Nottingham Trent University, UK

Hongyu Zheng, Shandong University of Technology, China

期刊简介

Engineering是中国工程院于2015年创办的工程科技综合性期刊，得到了联合国教科文组织（UNESCO）、国际工程与技术科学院理事会（CAETS）以及美国、英国、法国、德国、瑞典、荷兰、澳大利亚、韩国、印度等各国国家工程科学院和国内外专家学者的积极支持。

Engineering旨在提供一个高水平的工程科技重大成果发布与交流平台，并探讨工程科技发展的热点和难点问题，展望工程科技发展未来等，以促进工程科技更快发展，更好造福于人类，创造更美好的未来。

Engineering主要报道在科学发现的基础上、通过创新形成新的生产力、推动具有重大经济社会意义和世界先进水平的工程和产业的发展。具体栏目包括新闻热点、观点述评、工程成就、研究论文等。

Engineering由中国工程院、中国工程院战略咨询中心、高等教育出版社与国际出版商爱思唯尔合作出版。期刊为月刊，以开放获取（Open Access）的方式出版，并在期刊网站上提供英文和中文版，已被SCI、EI、Scopus、DOAJ、CSCD等国际权威检索系统收录。

2016年，Engineering入选 “中国科技期刊登峰计划“；2019年，入选 “中国科技期刊卓越行动计划” 领军期刊。期刊最新SCI影响因子12.8，工程综合领域Q1区。

收稿方向

· 机械与运载工程

· 信息与电子工程

· 化工、冶金与材料工程

· 能源与矿业工程

· 土木、水利与建筑工程

· 环境与轻纺工程

· 农业

· 医药卫生

· 工程管理

期刊官网

https://www.sciencedirect.com/journal/engineering

http://eng.engineering.org.cn

投稿网址

https://www.editorialmanager.com/eng/

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Engineering

ISSN 2095-8099

CN 10-1244/N

IF 12.8 Q1

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