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恩智浦始终秉持着“智慧生活，安全连结”这一理念，助推各种智能解决方案，使我们的生活变得更加轻松、优质和安全。恩智浦是嵌入式应用安全连接解决方案的世界领导者，它正在推动汽车、工业和物联网、移动和通信基础设施市场的创新。

在这里，有一个神秘且高端的团队，他们既能创新，又能研发，还具有领导力，他们就是 —— 

CTO (Chief Technology Office)

目前CTO部分职位正在热招中，

快来看看有没有你心仪的吧！

恩智浦期待你的加入！

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申请方式②

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Manufacturing Program Manager

Location: Shanghai

(上下滑动启阅)

Responsibilities:

- Capability to accurately and efficiently work on multiple projects.

- Coordinate project plan execution and collaborates with various functional levels, including Marketing, Procurement, Product Engineering, Planning, Program Management & Vendors to meet schedule and budget targets.

- Obtain quotes from vendors and manage project purchase orders through production release.

- Pursue and support cost reduction activities to achieve established company goals.

- Ability to proactively identify and resolve engineering and manufacturing related issues and have a thorough understanding of PCB &  PCBA manufacturing.

- Interacts with Contract Manufacturers (CM) to resolve component procurement issues, and review the production cost.

- Address vendor and CM issues including delivery, quality, and costs through corrective actions.

- Participate in peer reviews of program management and contract manufacturing to improve hardware development process across the Board Solutions Group.

- Possess a detailed knowledge of an Agile & ERP system.

- Review and approve Engineering Change Orders (ECO) applicable to products.

- Provide technical support via direct communication to internal customers & contract manufacturer.

- Schedule first article acceptance by stakeholders including Out of Box Experience (OOBE) and System Validation Test (SVT) when required.

- Work cross functionally to ensure the resolution of problems and actions as needed.

Requirements:

- Bachelor’s degree or above, major in electronics, product & industrial design, or related field.

- Minimum of 5 years of experiences in hardware board design or equivalent working experience in a design/manufacturing environment.

- Understand system-level design including mechanical, thermal, PCBA, cabling, PSU, firmware, etc.

- Understand the manufacturing process and quality requirements. Understand the DFx process.

- Solid high-speed digital signal design and test experience is required.

- Solid understanding of electronics components are required.

- Understand regulatory requirements and experience with compliance tests like FCC/CE.

- Master Cadence tools including Allegro and OrCAD.

- Good technical and analytical skills with the ability to perform electronic system troubleshooting and debug effectively.

- Experience in Ethernet switch, router, wireless charging, embedded systems, power meter, RF and wireless, Touchpad/Touch-screen system development will be an extreme advantage.

- Knowledge in CPLD design, micro-Controller programming, Linux programming will be an advantage.

- Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated.

Test Engineer

Location: Shanghai

(上下滑动启阅)

Responsibilities :

- Responsible for the design and development of test solution in terms of hardware design and software coding for product functional test in factory.

- Understand test specification and requirement given by design and manufacturing team, and analyzed product features to proposal the test coverage, as well as design the test system.

- Capable in understanding product design schematics and circuit diagram, and identify / proposed measurement points and test points with design and PCB CAD team.

- Identify and select suitable test equipment for product electrical measurement.

- Ability to design electronic circuit and source for electronics components for use to interface with product during testing.

- Perform test software coding or code development to drive test equipment, product-firmware interface, test result data-log, and fixture software control.

- Brainstorm and provide ideas, suggestions and solution to the various approach of testing a product.

- Design and work with contract manufacturer to designing test fixture & jigs to support the production.

- Participate in peer reviews of test engineering to improve hardware test process and efficiency across the Board Solutions Group.

- Conduct research into new technology and methodology for consistent measurement of a product feature.

- Work cross functionally to ensure the resolution of problems and actions as needed.

- Ability to work independently, resolve technical and manufacturing issues without detailed direction, and work as part of a team.

- Ability to work within strict deadlines.

- Capability to accurately and efficiently work on multiple projects.

Requirements:

- Bachelor’s degree or above, major in electronics, product & industrial design, or related field.

- Minimum 5 years’ related working experience.

- Test and measurement instrumentation exposure and experience in software development for remote equipment control is required.

- Knowledge in EMC rules, like FCC/CE, will be an advantage.

- Possess software coding experience. C, C++, Python, Linux, Android and script programming skill. Experience with NI Labview is a plus.

- Prior experience with CPLD/FPGAs in implementing advanced HW control / monitoring / logging is highly desirable.

- Good technical and analytical skill with ability to perform electronic system debug effectively

- Experience in digital networking manufacturing test development, power meter, RF and wireless test development, Touchpad/Touch-screen device test development will be an extreme advantage.

- Knowledge in micro-Controller programming, Android, Linux programming will be an advantage.

- Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated.

Senior Security Software Engineer

Location: Shanghai

(上下滑动启阅)

Responsibilities:

- Specification and implementation of cryptographic algorithms and secure software based on functional requirements.

- Protection of these implementations against side channel and fault attacks.

- Writing specification documents including security protection mechanisms.

- Driving and accompanying certification procedures including generation of related documents.

- Specification of Verification Environments.

- Support Firmware and OS teams using the secure software.

Requirements：

- Bachelor’s degree or above, major in e mathematics, computer science, electronic/ electrical engineering, information technology or relevant discipline.

- Minimum 5 years’ related working experience.

- Experience in embedded software development using C and assembly.

- Understanding of CPU architecture (Preferable ARM or RISC-V).

- Understanding of symmetric and asymmetric cryptography.

- Experience in implementing cryptographic algorithms such as OSCCA (SM2, SM3, SM4, …), DES, AES, SHA, RSA, ECC, …

- Knowledge of hardware and software countermeasures against side channel and fault attacks is highly appreciated.

- Be a team player, you have initiative and you get results.

- Be able to communicate in English with international team.

Device Modeling Lab Engineer

Location: Tianjin / Beijing

(上下滑动启阅)

Responsibilities:

- On-wafer device characterization, which includes DC, CV, 1/f noise, s-parameters, pulse IV, etc. The devices include but are not limited to MOS, LDMOS, BJT, diode, resistor, capacitor, etc.

- Maintain the characterization lab.

- Develop characterization method for new devices or new tests. Improve measurement efficiency through automation or better methodology.

- Be exposed to advanced technologies used by the company, and when time permits will have chance to work on device compact modeling and fab transfer work.

- Work closely with modeling, device, and process engineers.

Requirements:

- Bachelor’s degree or above, major in Electronic Engineering or other related fields.

- Have 2 years’ related working experience or more.

- Knowledge and experience with DC, HV, and RF device characterization techniques. A big plus if have used ICCAP.

- Good background in semiconductor device physics or EM.

- Good computer programming skill. Coding experience with Python is a plus.

- Outstanding communication and interpersonal skills.

Packaging Engineer

Location: Tianjin

(上下滑动启阅)

Responsibilities:

- Focus on FCCSP (Flip Chip CSP) package process development

- Define and validate package designs, materials and processes used for development of new products for NXP. 

- Develop DOE’s and tests to evaluate suitability and reliability of package solutions. 

- Work with the Business Lines and the factories (both internal to NXP and OSAT) to qualify the package/product solutions.

- Manage the package process using industry standard project management tools.

- Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).

- Address and solve materials and processing issues that may occur during the development process.

- May involve international travel to package assembly sites and NXP suppliers.

Requirements:

- Bachelor or Master degree in Mechanical Engineering, Automation Engineering or Chemical Engineering.

- 3~5 years of FCCSP package/process development work experience is highly preferred.

- CET-6 equivalent or above is preferred

- Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.

- Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.

- Knowledge of Statistical Analysis and Design of Experiment is a plus.

- Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

往期推荐

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