社招 | 恩智浦热招职位，快来入手！

恩智浦微招聘 2022-09-18

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寒来暑往，秋收冬藏。

不知不觉中，2021年只剩下最后一个月。

年初立下的目标，是否都有实现呢？

小编在此献上NXP社招职位祝你一臂之力~

恩智浦期待你的加入！

如何申请？

申请方式①

将简历投递至：talent@nxp.com

邮件注明：姓名+申请职位+工作城市

申请方式②

点击文末"阅读全文"，

找到职位，输入职位编号(R-100*****)

进行申请！

Principal RF Development Engineer

Location: Chengdu

R-10029468

点击展开职位描述

Responsibilities:

• Develop discrete and integrated power transistors and SIP up to 6GHz for cellular, emerging, small signal and RF power markets based on GaN, LDMOS and SiGe technology.

• Involves electromagnetic simulation, modeling and low impedance transistor internal and external matching networks, passive components and substrate simulation and layout.

• Design integrated passives network, wire bonds, packaging interfaces and PCB board level matching. The design process uses a combination of measurement based techniques (e.g. loadpull and S parameter data, etc) and CAD software with the use of linear or non-linear models and design kits.

• Make use of Agilent’s ADS, Momentum, FEM, 3D and planar electromagnetic simulation tools. Work closely with global device&package engineers, product engineers, project managers, modeling engineers, application engineers and manufacturing personnel for successful and timely product introduction, and report to local management team.

Qualifications:

• Master's degree, major in Electrical Engineering.

• At least 2 years of experience in RF power transistor and circuit design.

• The applicant must have a strong background on microwave and RF engineering, and emphasis on one or several of the following areas is highly desirable.

• Direct experience in designing RF power transistor internal-matching networks using GaN, LDMOS, etc and direct experience working with RF power products at the RF system level is preferred.

• Hands-on experience with board level tuning and optimization of internal and external matching networks.

• Experience and understanding of power amplifier, circuit linearization and high-efficiency design techniques.

• Microwave measurement techniques (s-parameters, loadpull setups, VNA calibration techniques, spectrum analyzers, power meters, etc).

• Working knowledge with Agilent's Advanced Design System (ADS) and HFSS.

• Strong communication skills and ability to work with global teams. Good language skill in English.

• Self motivator and able to work independently.

Principal IoT Solutions Engineer

Location: Shanghai

R-10032912

点击展开职位描述

Responsibilities:

• Work within Solutions & Connectivity Innovation segment of Edge Processing BL to develop and integrate new embedded AI/ML based voice and vision IoT solutions.

• Work closely and partial time need onsite support local customers for their product development and trouble shooting from concept stage to mass production.

• Work as software application engineer to support product marketing, FAE and distributor teams to resolve turnkey IoT solutions technical issues.

• Support designers, system architecture engineers and product marketers for new product definition and architectural proposals.

• Translate customer / market requirements into technical languages.

• Investigate and analyze consumer and industrial market applications and competitors’ solutions.

• Document, design, and prototype system level technical application requirements.

Qualifications:

• Master's degree, major in Microelectronics, Electronics, Electrical Engineering, Computer Science or relevant disciplines with at least 6 years related working experience.

• Solid skills for C/C++ & Python programming and real coding capability with GIT SCM experiences, Better to have github contribution knowhow.

• Rich experience for working with embedded Linux or FreeRTOS / Zephyr etc. OS which widely used for MPU and MCU platform.

• Experience with and willingness to gain deep technical knowledge around connectivity, edge compute and machine learning for software and systems design.

• Excellent communications and presentation skills and good command of English for listening, speaking, reading and writing. Prefer with multi-nation company working experience.

• Prefer to have real experience for object / facial recognition, voice recognition AI/ML based product design and development.

• Prefer to have knowledge of one or more wireless connectivity like WiFi/BLE/NFC/UWB etc. for software application design.

• Flexible thinker with track record of innovation, Entrepreneurial spirit – fast moving and sense of urgency.

Principal Software Engineer

Location: Shanghai

R-10031826/R-10032632

点击展开职位描述

Responsibilities:

• Create Android/Android Automotive BSP release based on i.MX SOCs, including UBOOT, Linux Kernel, Security OS, Android Frameworks and HALs.

• Enable Matter/OTBR stack in host side and build the system.

• Implement miscellaneous Android HALs and Linux Kernel drivers in Android/Android Automotive, such as Camera&ISP, Audio, Power, GPU 2D&3D, Display, USB, Storage, Keymaster, etc.

• Implement Android Security release features like AVB, Keymaster, A/B boot.

• Optimize system overall performance about boot time, benchmark tools.

Qualifications:

• Master's degree, major in electrical or electronic engineering, computer science or relevant disciplines.

• Over 6 years of experience in related fields.

• Familiar with assembly or C/C++ programming and embedded OS like Android, Linux, uBoot, ATF, Security OS.

• Extensive embedded software development experience including device drivers and consumer embedded applications.

• Understand Android framework and HAL.

• Understand connectivity protocols such as Thread/BLE/Zigbee

• Experience in one of following area is required or strongly preferred:

• ALSA, Camera, Display Linux Device Driver or Android HAL development for Android.

• System performance optimization like boot time, and UI performance.

• Experience with ARM architecture is preferred.

• Experience with Automotive IVI system is preferred.

Principal Systems Architect –

Battery Management Systems

Location: Shanghai

R-10031882

点击展开职位描述

Responsibilities:

• Creation of functional requirements definition based on the China market and customer requirements.

• Requirement analysis, generation of concepts and documentation.

• Benchmark of different architectures and design space exploration to find the best performance, power and die size fit.

• Translating high level system requirements to a chain of smaller building blocks.

• Secure optimal specification set for the product in alignment with existing capabilities (IP, resources, target timeline, …)

• Technical leadership of the product definition process.

• Support product design-in for key customers.

• Strong collaboration with the system architecture team, the digital and analog design team as well as with the application engineering teams throughout the whole development cycle.

• Definition of verification requirements according to China specific automotive standards.

Qualifications:

• Master's degree, major in Electrical or Electronics engineering, Physics, or related discipline.

• At least 7 years of experience within product definition, design or similar in industrial or automotive semiconductor applications.

• Strong analytical skills to understand, model, and analyze electronic circuits and systems to propose breakthrough semiconductor solutions.

• Excellent communication skills both written and spoken in Mandarin and English as well as good cultural awareness.

Principal Test Engineer

Location: Shanghai

R-10028892

点击展开职位描述

Responsibilities:

• Responsible for the design and development of test solution in terms of hardware design and software coding for product functional test in factory.

• Understand test specification and requirement given by design and manufacturing team, and analyzed product features to proposal the test coverage, as well as design the test system.

• Capable in understanding product design schematics and circuit diagram, and identify / proposed measurement points and test points with design and PCB CAD team.

• Identify and select suitable test equipment for product electrical measurement.

• Ability to design electronic circuit and source for electronics components for use to interface with product during testing.

• Perform test software coding or code development to drive test equipment, product-firmware interface, test result data-log, and fixture software control.

• Brainstorm and provide ideas, suggestions and solution to the various approach of testing a product.

• Design and work with contract manufacturer to designing test fixture & jigs to support the production.

• Participate in peer reviews of test engineering to improve hardware test process and efficiency across the Board Solutions Group.

• Conduct research into new technology and methodology for consistent measurement of a product feature.

• Work cross functionally to ensure the resolution of problems and actions as needed.

• Ability to work independently, resolve technical and manufacturing issues without detailed direction, and work as part of a team.

• Ability to work within strict deadlines.

• Capability to accurately and efficiently work on multiple projects.

Qualifications:

• Master's degree, major in Electrical Engineering, Product & Industrial Design, or related fields.

• At least 6 years of experience in related fields.

• Test and measurement instrumentation exposure and experience in software development for remote equipment control is required.

• Knowledge in EMC rules, like FCC/CE, will be an advantage.

• Possess software coding experience. C, C++, Python, Linux, Android and script programming skill. Experience with NI Labview is a plus.

• Prior experience with CPLD/FPGAs in implementing advanced HW control / monitoring / logging is highly desirable.

• Good technical and analytical skill with ability to perform electronic system debug effectively.

• Experience in digital networking manufacturing test development, power meter, RF and wireless test development, Touchpad/Touch-screen device test development will be an extreme advantage.

• Knowledge in micro-Controller programming, Android, Linux programming will be an advantage.

• Excellent interpersonal and communication skills, good teamwork adaptability, good oral and written English skills, self-motivated.

Principal Analog Design Engineer

Location: Shanghai

R-10026471

点击展开职位描述

Responsibilities:

• Carry out development activities from design, layout, simulation to physical validation for mixed signal integrated circuits.

• Guarantee the technical deliverables of his jobs in terms of quality and performance.

• Evaluate the product with application team to meet customer specification.

• Work with system architect for IC definition and tradeoff between area and power.

• Collaborate with Marketing and Customers to define chip specifications and product roadmaps.

• Support product validation, ATE test and qual teams during high volume ramp-up.

• Work with other team members to build up design knowledge and improve way of working.

• Develop his/her leadership on his/her domain of skills and actions.

• Coach junior team members on design knowledge and way of working.

Qualifications:

• Bachelor's degree or above, major in Electrical Engineering.

• At least 10 years of experience in analog design.

• Familiar with integrated circuit electronics including device level physics, particularly analog system and transistor level circuit design.

• Experience with high precision analog design and ultra low power design are highly desirable.

• Experience with the Cadence design tools: Virtuoso, Spectre, AMS etc.

• Creative thinker with helicopter view, capable of finding an appropriate solution to complex problems.

• Good communicator in both oral and written English.

• Team player, able to work in a cross-functional-team environment.

Principal Digital Design Engineer

Location: Shanghai

R-10032758

点击展开职位描述

Responsibilities:

• You will be responsible for the digital design of IP modules, IP subsystems, and/or for the SoC top level integration for security-certified microcontrollers:

• Architectural specification of IP modules, IP subsystems and SoC top level for highly secure microcontroller SoC's.

• RTL design and verification of digital IP modules: Responsible for the implementation of your IP modules, overseeing the module-level verification in close cooperation with the verification team, and debugging failing test cases on module level and SoC top level.

• Power-aware RTL design and power-optimization for contactless devices.

• SOC level performance optimization.

• Contribute to system architecture reviews and SoC design reviews, and conduct peer reviews on the designs of other designers.

• Synthesis: deliver a timing clean design with reliable constraints.

• RTL quality checks: provide reports and waivers for LEC, LINT, and CDC checks.

• Contribute to the post-silicon validation of SOC’s and IP Subsystems.

• Lead and mentor other engineers in the team, apply state-of-the-art design methodologies.

• Take the lead in analyzing and solving IP- and system level issues until resolution and closure.

Qualifications:

• Master's degree, major in Electrical Engineering or Computer Science.

• At least 8 years of experience of hands on RTL design of SOC products.

• Solid understanding of microcontroller architectures (ARM / RISC-V preferred).

• Working experience in advanced verification methodologies, synthesis, revision control.

• Knowledge of secure microcontroller / smart card architectures is beneficial, but not a must.

• Quality-minded, result oriented.

• Must have expert problem solving skills.

• Crisp and concise communication skills (both verbal and written) are required

• Personal Traits:

• Rigorous and methodical with strong analytical skills.

• Flexible and adaptable with an ability to verify and debug on different platforms and abstraction level.

• Tenacity in tracing and finding problems, with attention to detail.

• Ability to question and identify weaknesses in specifications, tool environments, etc.

• Good team player with ability to work across functional teams, sites, and cultures.

Principal FAE- Wifi

Location: Shanghai

R-10029027

点击展开职位描述

Responsibilities:

• Support NXP's wireless and connectivity solutions.

• Drive demand creation and design-in activity at customer sites in close cooperation with the NXP business lines.

• Provide technical skills & support to NXP's sales staff and will work with the NXP technical community about technical issues and future roadmap of your customer.

• Working closely with sales, marketing to promote NXP Wi-Fi and Bluetooth product & corresponding vertical solutions to customer.

• Major technical window to customer, provide project management to ensure customer project success.

• Provide technical supporting for product benchmarking, identifying and clarifying any technical issues of customer product design.

Qualifications:

• Master's degree, major in Electrical Engineering, computing science or relevant disciplines.

• At least 3 years of experience in Wi-Fi and Bluetooth connectivity area.

• Strong software skills,better to have experience in wireless gateway products software design.

• Experience on Linux programming experience, kernel and driver experience is plus.

• Knowledge of operating system, Linux/Android Kernel and BSP programming.

• Knowledge of wifi RF performance calibration.

• Good communication skills internally and externally, strong learning skill is a must.

Senior Supplier Quality Development Engineer

Location: Shanghai

R-10031974

点击展开职位描述

Responsibilities:

• Due to the expansion of business and dynamic market changes that the world is facing, NXP is trying to recruit a new talent located in China in supporting new Si wafer substrate growing business in world wild.

• This is a senior engineer position which is known as Supplier Development Engineering (SDE). As a SDE, you evaluate the process designs and ensure the process flow, inline quality control are meeting the ZD expectation.

• You collaborate with Commodity Managers, Assembly Engineering and Innovation team to determine the right needs and product specifications based on the industry standard for automotive product.

• In this role, you will engage in development activities working with cross-functional product team in understanding and resolving technical issues and highlighting quality risks to core teams and management.

• You will be responsible for Si substrate supplier development and quality manufacturing. • You will also support the design and development of technically complex manufacturing process to enable new product designs and functional requirement.

Qualifications:

• Master's degree, major in Engineering or equivalent practical experience.

• At least 6 years of experience in advance substrate manufacturing process, supplier quality or equivalent.

• Experience/ knowledge in the follow technology: Si wafer substrate manufacturing process such as EPI wafer, Polish wafer, GaN, etc.

• Expert audit experience of supply chain and semiconductors materials suppliers.

• Certified auditor in ISO/IATF and other automotive standards will be an added advantage.

Preferred Qualifications:

• Strong Knowledge of common Si wafer substrate and Foundry process.

• Demonstrated record of strong problem solving skill with 6-sigma, DOE’s and static analysis tools such as Minitab, and/ or JMP.

• Ability to proactively influence the product design process by proposing DFx improvement with associated data.

• Comfortable working both independently and as a team player in a globally distributed team. Ability to actively participate in complex technical discussions.

• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule.

Senior Field Quality Engineer

Location: Shenzhen

R-10031748

点击展开职位描述

Responsibilities:

• Full ownership of the assigned Customers in terms of achieving the FQE specific targets.

• Be the Customer quality advocate for the assigned Customers.

• Drive a positive Customer perception of NXP's Quality.

• Execute the CQC reduction plan for the assigned Customers.

enable Customer engineers / technicians to perform an effective initial evaluation of NXP device.

• Assist the Customer in the resolution of Customer caused issues (e.g. ESD/EOS protection, parts programming, etc.)

• Applying a diligent CQC data analysis for every return reported by the Customer to fully understand the device history.

• Identify any repeat occurrences possibly during FFV (field failure verification) and data mining.

• Responsible for acquisition, implementation and maintenance of the required tools to ensure excellent FFV capability.

Qualifications:

• Master's degree, major in related fields.

• At least 2 years of experience in related fields.

• Full ownership of the assigned Customers in terms of achieving the FQE specific targets.

• Be the Customer quality advocate for the assigned Customers.

• Drive a positive Customer perception of NXP's Quality.

• Execute the CQC reduction plan for the assigned Customers.

Senior Systems & Applications Engineer

Location: Shenzhen

R-10032111

点击展开职位描述

Responsibilities:

• To produce reference designs of new NXP smart power products that enable the products to be correctly positioned in the customer.

• Provide market requirement, customer requirement, and competitor analysis to ensure successful new product development and new product launch.

• To ensure that all technical problems the customers have when working with our products are resolved in a way consistent with the customer requirement.

• Drive the design-in activity in designated key customers.

• Provide technical instruction and develop training materials to regional FAE teams and Disty FAE teams.

Qualifications:

• Master’s degree, major in power electronics or equivalent deep technical background in power electronics.

• At least 6 years of experience in related fields.

• Resonant application experience is preferred.

• Moderate English skill for reading, writing and speaking.

• Self-motivated to learn new technology.

Systems & Application Engineer on Functional Safety

Location: Tianjin

R-10032955

点击展开职位描述

Responsibilities:

• Promote existing product portfolio to potential new customers in order to grow market share, defining product derivatives when appropriate and providing guidance in their system architecture to match products performance.

• Support existing customers in helping them solve application and system specific issues that they may encounter during the lifetime of the product.

• Develop product demonstration kit, models and system solution for end customers, based on in-depth knowledge of Battery Management System and embedded systems.

• Work with customers, field sales, FAEs, product definers, design engineers and the product line manager to support a family of power products for the business unit to plan roadmaps, specify new products and secure design wins.

• Perform requirements analysis and tradeoffs, create system level requirements descriptions, and work with product definers to create product specifications. Perform deep competitive analysis and provide plans and directions to drive market based solutions.

• Create customer facing technical documents such as data sheets, application notes, contributed articles and conference papers and contribute to reference designs and demos.

Qualifications:

• Bachelor's degree or above, major in Electronic Engineering and in-depth knowledge over System architecture and IC components.

• 3+ years of experience in related fields.

• Skills and experience on customer interfacing and market exploration with sense of urgency. Industry experience in Energy Storage System, Battery Management System, • Inverter or Power Electronics etc.

• Good academic background is admired, as R&D project experience and professional articles publications.

• Excellent communications skills, verbal and written. Fluent English is admired.

• Specific skillset and knowledge, including electronics HW&SW design, Testing, Functional Safety or EMC optimization.

Security Hardware Design Engineer

Location: Tianjin

R-10032792

点击展开职位描述

Responsibilities:

• Within the Crypto & Security Innovation Center you will be part of a dedicated team focusing on research and development for future cryptographic and security solutions ranging from security IP design to strong end-to-end security solutions and vulnerability analysis. You will be part of a stimulating work environment and global team developing security solutions for all of NXP’s business lines.

• As a Security Hardware Design Engineer, you will be responsible for:

• Design and verification of cryptographic & security hardware IPs.

• Developing IPs for OSCCA standards, especially SM2, SM3 and SM4.

• Implementation of security countermeasures to protect IP against side channel and fault attacks.

• Drive innovation on way of working in secure HW design, especially secure design flow and methodology.

Qualifications:

• Bachelor's degree or above, major in Electronic Engineering.

• Experience in developing cryptographic IPs.

• Knowledge of security threats such as side channel or fault attacks and potential mitigations.

• High level of experience in ASIC design.

• Experience with RTL development in Verilog, synthesis, static timing analysis.

• IP verification and knowledge of UVM an advantage.

• Very good English communication skills and a pro-active attitude.

Facilities Engineer/Planner

Location: Tianjin

R-10030867

点击展开职位描述

Responsibilities:

• Responsible for planning, implementing, and maintaining the infrastructure and equipment of buildings and facilities.

• Perform analyses of operational processes, resource allocation, energy use, and safety processes, and recommend and implement improvements.

• Facility system management (ie.HVAC,WWTP,UPW,CDA) the urgent troublesooting, some general affair.

Qualifications:

• Bachelor’s degree or above, major in Mechanical related.

• 1-3 years of experience in related fields.

• Fluent in English, both writing and speaking.

• Master Microsoft office applications.

• Independent problem-solving, organization, interpersonal and communication skills.

• Good ability to learn new knowledge.

• Self-motivated and teamwork spirit.

Customer Quality Engineer

Location: Tianjin

R-10028290

点击展开职位描述

Responsibilities:

• Manage customer return process including problem solving process.

• Provide follow-up on all customer failure analyses, communication and issue resolution at all levels.

• Act as customer advocate for product quality. This includes customer and internal management communications and presentations, for customer and internal quality reviews.

• Customer interaction and negotiation on quality cases solving.

• Customer loyalty development.

• Product Support

• Interface with internal and external factories on reliability and quality issues.

• Support continuous improvement, defect reduction activities, and cost reduction activities.

• Lead product teams, factories, and associated support through quality issue resolution process.

• Support customers with technical reliability and quality consult.

• Work with customers to address product reliability and quality issues.

• Coordinate and/or Participate in the Change Action Board (CAB).

• Participate in Material Review Boards (MRB).

Qualifications:

• Master's degree, major in Electrical Engineering.

• Application Engineering or Design Experience on microprocessor.

• Demonstrated data analysis and problem solving skills.

• Ability to resolve complex customer issues and lead cross-functional teams.

• Strong written and verbal communication and presentation skills and ability to influence others.

• Process control and other six sigma tools knowledge.

• Flexibility to adjust to change and multiple ongoing issues in a fast-paced,customer-focused environment.

• Ability to work independent of management with leadership skills.

• Application Engineering experience would be an advantage.

• Overseas education and/or working experience are preferred.

Failure Analysis Engineer

Location: Tianjin

R-10031587

点击展开职位描述

Responsibilities:

• Failure Analysis Engineer will be responsible for analyzing the problem IC to find the root cause of failure, such as customer application problem, wafer manufacture defect, assembly package issue, etc.

• A Failure Analysis (FA) Engineer must be able to interpret test data, conduct bench-level testing verification of the failure mode and perform various product analysis processes to determine the failure mechanism of the reported problem.

• An in-depth understanding Analog and digital circuits are required.

• The devices analyzed include new designs/products, low yield on existing products, qualification failures, and returns from customers.

Qualifications:

• Master's degree, major in Electronic Engineering.

• 3+ years of experience in related fields.

• Demonstrated data analysis and problem solving skills.

• Ability to resolve complex customer issues and lead cross-functional teams.

• Strong English written and verbal communication and presentation skills and ability to influence others.

• Process control and other six sigma tools knowledge.

• Flexibility to adjust to change and multiple ongoing issues in a fast-paced, customer-focused environment.

• Ability to work independent of management with leadership skills.

Packaging Engineer

Location: Tianjin

R-10026802

点击展开职位描述

Responsibilities:

• Focusing on Flip Chip package process development.

• Define and validate package designs, materials and processes used for development of new products for NXP. Develop DOE’s and tests to evaluate suitability and reliability of package solutions.

• To provide technical solution in engineering to achieve yield, quality, cycle time and productivity goals.

• Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).

• Address and solve materials and processing issues that may occur during the development process.

Qualifications:

• Master's degree, major in Engineering (Mechanical Engineering, Automation Engineering or Chemical Engineering, etc).

• At least 3 years of experience of Flip Chip package/process development work experience is highly preferred.

• CET-6 equivalent or above is preferred.

• Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.

• Working knowledge of various IC packages like QFP, QFN, BGA, flip chip, wafer level fan-in and fan-out is a plus.

• Knowledge of Statistical Analysis and Design of Experiment is a plus.

• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.