《电化学》期刊“电子电镀专辑”
专辑介绍：《电化学》期刊的出版《电子电镀专辑》，分为上、下两期，由上海交通大学李明教授、常州大学陈智栋教授、电子科技大学何为教授、电子科技大学王翀副教授共同担任客座编辑。
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陈智栋, 王翀, 何为, 李明. “电子电镀专辑”序言[J]. 电化学, 2022, 28(6): 2104401.
Zhi-Dong Chen, Chong Wang, Wei He, Ming Li. Preface to Special Issue on Electronic Electroplating[J]. Journal of Electrochemistry, 2022, 28(6): 2104401.
DOI: 10.13208/j.electrochem.210440
作 者 聚 焦
Author Spotlight.
DOI: 10.13208/j.electrochem.210460
邹浩斌, 谭超力, 熊伟, 席道林, 刘彬云. 酸性镀铜添加剂开发及应用技术[J]. 电化学, 2022, 28(6): 2104531.
Hao-Bin Zou, Chao-Li Tan, Wei Xiong, Dao-Lin Xi, Bin-Yun Liu. Introduction of Development and Application Technology of Organic Additives for Acid Copper Electroplating[J]. Journal of Electrochemistry, 2022, 28(6): 2104531.
DOI: 10.13208/j.electrochem.210453
刘仁志, 谢平令, 王翀. 电沉积铜箔的微观组织结构——三维电结晶模式中的电结晶机理探讨[J]. 电化学, 2022, 28(6): 2104481.
Ren-Zhi Liu, Ping-Ling Xie, Chong Wang. Microstructure of Electrodeposited Copper Foil: Discussion on the Mechanism Model of Three-Dimensional Electrocrystallization[J]. Journal of Electrochemistry, 2022, 28(6): 2104481.
DOI: 10.13208/j.electrochem.210448
纪执敬, 凌惠琴, 吴培林, 余瑞益, 于大全, 李明. 玻璃通孔三维互连镀铜填充技术发展现状[J]. 电化学, 2022, 28(6): 2104461.
Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li. Development Status of Copper Electroplating Filling Technology in Through Glass Via for 3D Interconnections[J]. Journal of Electrochemistry, 2022, 28(6): 2104461.
DOI: 10.13208/j.electrochem.210446
王历, 吴敏娴, 李珺, 陈艳丽, 王文昌, 陈智栋. 低电压电沉积类金刚石碳膜的研究[J]. 电化学, 2022, 28(6): 2104441.
Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen. Study on Low Voltage Electrodeposition of Diamond-like Carbon Film[J]. Journal of Electrochemistry, 2022, 28(6): 2104441.
DOI: 10.13208/j.electrochem.210444
沈银飞, 陈艳丽, 王笙戌, 朱晔, 王文昌, 吴敏娴, 陈智栋. 酸性溶液中苯并三氮唑和3-巯基-1-丙烷磺酸钠在铜电极表面的电化学SERS研究[J]. 电化学, 2022, 28(6): 2104451.
Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen. Electrochemical SERS study of Benzotriazole and 3-mercapto-1-propanesulfonate in Acidic Solution on Copper Electrode[J]. Journal of Electrochemistry, 2022, 28(6): 2104451.
DOI: 10.13208/j.electrochem.210445
秦凯旋, 常鹏飞, 黄钰林, 李明, 杭弢. 钴互连化学机械抛光浆料中的界面腐蚀行为研究[J]. 电化学, 2022, 28(6): 2104471.
Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang. An Investigation on the Interface Corrosion Behaviors of Cobalt Interconnects in Chemical Mechanical Polishing Slurry[J]. Journal of Electrochemistry, 2022, 28(6): 2104471.
DOI: 10.13208/j.electrochem.210447
杨森, 王文昌, 张然, 秦水平, 吴敏娴, 光崎尚利, 陈智栋. 醇硫基丙烷磺酸钠对电解高性能锂电铜箔的影响[J]. 电化学, 2022, 28(6): 2104501.
Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen. Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries[J]. Journal of Electrochemistry, 2022, 28(6): 2104501.
DOI: 10.13208/j.electrochem.210450
马晓川, 李亚强, 杨培霞, 张锦秋, 安茂忠. 孔雀石绿对金属钴超填充和成核过程的影响[J]. 电化学, 2022, 28(6): 2104521.
Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, Mao-Zhong An. Influences of Suppressing Additive Malachite Green on Superconformal Cobalt filling and Nucleation[J]. Journal of Electrochemistry, 2022, 28(6): 2104521.
DOI: 10.13208/j.electrochem.210452
杨凯, 陈际达, 陈世金, 许伟廉, 郭茂桂, 廖金超, 吴熷坤. 高深径比通孔脉冲电镀添加剂及电镀参数的优化[J]. 电化学, 2022, 28(6): 2104491.
Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu. Optimization of Pulse Plating Additives and Plating Parameters for High Aspect Ratio Through Holes[J]. Journal of Electrochemistry, 2022, 28(6): 2104491.
DOI: 10.13208/j.electrochem.210449
赵健伟, 朱海锋, 于晓辉, 袁桂云, 孙志. 蚀刻引线框架用的弱碱性无氰镀银工艺的研究[J]. 电化学, 2022, 28(6): 2104551.
Jian-Wei Zhao, Hai-Feng Zhu, Xiao-Hui Yu, Gui-Yun Yuan, Zhi Sun. Study on Weak Alkaline Cyanide-Free Silver Plating Process for Etching Lead Frame[J]. Journal of Electrochemistry, 2022, 28(6): 2104551.
DOI: 10.13208/j.electrochem.210455
张远航, 安茂忠, 杨培霞, 张锦秋. 数值模拟方法在周期换向脉冲电镀通孔中的应用[J]. 电化学, 2022, 28(6): 2104511.
Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang. Application of Numerical Simulation Method in Periodic Pulse Reverse Electroplating Through Hole[J]. Journal of Electrochemistry, 2022, 28(6): 2104511.
DOI: 10.13208/j.electrochem.210451
缪桦, 李明瑞, 邹文中, 周国云, 王守绪, 叶晓菁, 朱凯. Sn-Ag-Cu三元合金焊料电沉积中添加剂的影响研究[J]. 电化学, 2022, 28(6): 2104411.
Hua Miao, Ming-Rui Li, Wen-Zhong Zou, Guo-Yun Zou, Shou-Xu Wang, Xiao-Jing Ye, Kai Zhu. Study on the Effect of Additives in the Electrodeposition of Sn-Ag-Cu Ternary Alloy Solder[J]. Journal of Electrochemistry, 2022, 28(6): 2104411.
DOI: 10.13208/j.electrochem.210441
孙云娜, 吴永进, 谢东东, 蔡涵, 王艳, 丁桂甫. 硅通孔内铜电沉积填充机理研究进展[J]. 电化学, 2022, 28(7): 2213001.
Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, Gui-Fu Ding. Research Progress of Copper Electrodeposition Filling Mechanism in Silicon Vias[J]. Journal of Electrochemistry, 2022, 28(7): 2213001.
DOI: 10.13208/j.electrochem.2213001
黄葵, 黄容姣, 刘素琴, 何震. 电子功能外延薄膜的电沉积[J]. 电化学, 2022, 28(7): 2213006.
Kui Huang, Rong-Jiao Huang, Su-Qin Liu, Zhen He. Electrodeposition of Functional Epitaxial Films for Electronics[J]. Journal of Electrochemistry, 2022, 28(7): 2213006.
DOI: 10.13208/j.electrochem.2213006
沈钰, 李冰冰, 马艺, 王增林. 化学镀钴和超级化学镀填充的研究进展[J]. 电化学, 2022, 28(7): 2213002.
Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang. Research Progress in Electroless Cobalt Plating and the Bottom-up Filling of Electroless Plating[J]. Journal of Electrochemistry, 2022, 28(7): 2213002.
DOI: 10.13208/j.electrochem.2213002
王小丽, 何为, 陈先明, 曾红, 苏元章, 王翀, 李高升, 黄本霞, 冯磊, 黄高, 陈苑明. PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响[J]. 电化学, 2022, 28(7): 2213007.
Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen. Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution[J]. Journal of Electrochemistry, 2022, 28(7): 2213007.
DOI: 10.13208/j.electrochem.2213007
倪修任, 张雅婷, 王翀, 洪延, 陈苑明, 苏元章, 何为, 陈先明, 黄本霞, 续振林, 李毅峰, 李能彬, 杜永杰. 电沉积纳米锥镍的生长机理及其性能的研究[J]. 电化学, 2022, 28(7): 2213008.
Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du. Mechanism and Application of Nickel Nano-Cone by Electrodeposition on a Flexible Substrate[J]. Journal of Electrochemistry, 2022, 28(7): 2213008.
DOI: 10.13208/j.electrochem.2213008
徐佳莹, 王守绪, 苏元章, 杜永杰, 齐国栋, 何为, 周国云, 张伟华, 唐耀, 罗毓瑶, 陈苑明. 特殊整平剂甲基橙在通孔电镀铜的应用[J]. 电化学, 2022, 28(7): 2213003.
Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen. Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler[J]. Journal of Electrochemistry, 2022, 28(7): 2213003.
DOI: 10.13208/j.electrochem.2213003
杨家强, 金磊, 李威青, 王赵云, 杨防祖, 詹东平, 田中群. 亚硫酸盐无氰电沉积金新工艺及机制[J]. 电化学, 2022, 28(7): 2213005.
Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian. Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath[J]. Journal of Electrochemistry, 2022, 28(7): 2213005.
DOI: 10.13208/j.electrochem.2213005
谭柏照, 梁剑伦, 赖子亮, 罗继业. 高均匀性的铜柱凸块电镀[J]. 电化学, 2022, 28(7): 2213004.
Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo. Electrochemical Deposition of Copper Pillar Bumps with High Uniformity[J]. Journal of Electrochemistry, 2022, 28(7): 2213004.
DOI: 10.13208/j.electrochem.2213004
翟悦晖, 彭逸霄, 洪延, 陈苑明, 周国云, 何为, 王朋举, 陈先明, 王翀. 铜互连电镀中有机添加剂的合成与分析[J]. 电化学, doi: 10.13208/j.electrochem.2208111.
Yue-Hui Zhai, Yi-Xiao Peng, Yan Hong, Yuan-Ming Chen, Guo-Yun Zhou, Wei He, Peng-Ju Wang, Xian-Ming Chen, Chong Wang. Synthesis and Evaluation of Organic Additives for Copper Electroplating of Interconnects[J]. Journal of Electrochemistry, doi: 10.13208/j.electrochem.2208111.
DOI: 10.13208/j.electrochem.2208111
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