本刊推荐 | “腐蚀与电子电镀”文章推荐（2021-2022）

Li-Jun Wei, Zi-Han Zhou, Yun-Wen Wu, Ming Li, Su Wang. Research Progresses of Cobalt Interconnect and Superfilling by Electroplating in Chips[J]. Journal of Electrochemistry, 2022, 28(6): 2104431.

魏丽君, 周紫晗, 吴蕴雯, 李明, 王溯. 芯片钴互连及其超填充电镀技术的研究进展[J]. 电化学, 2022, 28(6): 2104431.

DOI: 10.13208/j.electrochem.210443

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210443

Zhi-Jing Ji, Hui-Qin Ling, Pei-Lin Wu, Rui-Yi Yu, Da-Quan Yu, Ming Li. Development Status of Copper Electroplating Filling Technology in Through Glass Via for 3D Interconnections[J]. Journal of Electrochemistry, 2022, 28(6): 2104461.

纪执敬, 凌惠琴, 吴培林, 余瑞益, 于大全, 李明. 玻璃通孔三维互连镀铜填充技术发展现状[J]. 电化学, 2022, 28(6): 2104461.

DOI: 10.13208/j.electrochem.210446

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210446

Li Wang, Min-Xian Wu, Jun Li, Yan-Li Chen, Wen-Chang Wang, Zhi-Dong Chen. Study on Low Voltage Electrodeposition of Diamond-like Carbon Film[J]. Journal of Electrochemistry, 2022, 28(6): 2104441.

王历, 吴敏娴, 李珺, 陈艳丽, 王文昌, 陈智栋. 低电压电沉积类金刚石碳膜的研究[J]. 电化学, 2022, 28(6): 2104441.

DOI: 10.13208/j.electrochem.210444

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210444

Yin-Fei Shen, Yan-Li Chen, Sheng-Xu Wang, Ye Zhu, Wen-Chang Wang, Min-Xian Wu, Zhi-Dong Chen. Electrochemical SERS study of Benzotriazole and 3-mercapto-1-propanesulfonate in Acidic Solution on Copper Electrode[J]. Journal of Electrochemistry, 2022, 28(6): 2104451.

沈银飞, 陈艳丽, 王笙戌, 朱晔, 王文昌, 吴敏娴, 陈智栋. 酸性溶液中苯并三氮唑和3-巯基-1-丙烷磺酸钠在铜电极表面的电化学SERS研究[J]. 电化学, 2022, 28(6): 2104451.

DOI: 10.13208/j.electrochem.210445

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210445

Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang. An Investigation on the Interface Corrosion Behaviors of Cobalt Interconnects in Chemical Mechanical Polishing Slurry[J]. Journal of Electrochemistry, 2022, 28(6): 2104471.

秦凯旋, 常鹏飞, 黄钰林, 李明, 杭弢. 钴互连化学机械抛光浆料中的界面腐蚀行为研究[J]. 电化学, 2022, 28(6): 2104471.

DOI: 10.13208/j.electrochem.210447

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210447

Sen Yang, Wen-Chang Wang, Ran Zhang, Shui-Ping Qin, Min-Xian Wu, Naotoshi Mitsuzaki, Zhi-Dong Chen. Effect of Sodium Alcohol Thiyl Propane Sulfonate on Electrolysis of High Performance Copper Foil for Lithium Ion Batteries[J]. Journal of Electrochemistry, 2022, 28(6): 2104501.

杨森, 王文昌, 张然, 秦水平, 吴敏娴, 光崎尚利, 陈智栋. 醇硫基丙烷磺酸钠对电解高性能锂电铜箔的影响[J]. 电化学, 2022, 28(6): 2104501.

DOI: 10.13208/j.electrochem.210450

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210450

Xiao-Chuan Ma, Ya-Qiang Li, Pei-Xia Yang, Jin-Qiu Zhang, Mao-Zhong An. Influences of Suppressing Additive Malachite Green on Superconformal Cobalt filling and Nucleation[J]. Journal of Electrochemistry, 2022, 28(6): 2104521.

马晓川, 李亚强, 杨培霞, 张锦秋, 安茂忠. 孔雀石绿对金属钴超填充和成核过程的影响[J]. 电化学, 2022, 28(6): 2104521.

DOI: 10.13208/j.electrochem.210452

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210452

Kai Yang, Ji-Da Chen, Shi-Jin Chen, Wei-Lian Xu, Mao-Gui Guo, Jin-Chao Liao, Zeng-Kun Wu. Optimization of Pulse Plating Additives and Plating Parameters for High Aspect Ratio Through Holes[J]. Journal of Electrochemistry, 2022, 28(6): 2104491.

杨凯, 陈际达, 陈世金, 许伟廉, 郭茂桂, 廖金超, 吴熷坤. 高深径比通孔脉冲电镀添加剂及电镀参数的优化[J]. 电化学, 2022, 28(6): 2104491.

DOI: 10.13208/j.electrochem.210449

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210449

Yuan-Hang Zhang, Mao-Zhong An, Pei-Xia Yang, Jin-Qiu Zhang. Application of Numerical Simulation Method in Periodic Pulse Reverse Electroplating Through Hole[J]. Journal of Electrochemistry, 2022, 28(6): 2104511.

张远航, 安茂忠, 杨培霞, 张锦秋. 数值模拟方法在周期换向脉冲电镀通孔中的应用[J]. 电化学, 2022, 28(6): 2104511.

DOI: 10.13208/j.electrochem.210451

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210451

Zhao-Xia Dai, Da-Jiang Zheng, Guang-Ling Song, Dan-Qing Feng, Pei Su. Biofouling Behaviors of Pure Titanium Surface Polarized at Different Potentials[J]. Journal of Electrochemistry, 2022, 28(5): 2109061.

戴昭霞, 郑大江, 宋光铃, 冯丹青, 苏培. 不同电位下极化后的纯钛表面生物污损行为[J]. 电化学, 2022, 28(5): 2109061.

DOI: 10.13208/j.electrochem.210906

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210906

Yun-Na Sun, Yong-Jin Wu, Dong-Dong Xie, Han Cai, Yan Wang, Gui-Fu Ding. Research Progress of Copper Electrodeposition Filling Mechanism in Silicon Vias[J]. Journal of Electrochemistry, 2022, 28(7): 2213001.

孙云娜, 吴永进, 谢东东, 蔡涵, 王艳, 丁桂甫. 硅通孔内铜电沉积填充机理研究进展[J]. 电化学, 2022, 28(7): 2213001.

DOI: 10.13208/j.electrochem.2213001

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213001

Kui Huang, Rong-Jiao Huang, Su-Qin Liu, Zhen He. Electrodeposition of Functional Epitaxial Films for Electronics[J]. Journal of Electrochemistry, 2022, 28(7): 2213006.

黄葵, 黄容姣, 刘素琴, 何震. 电子功能外延薄膜的电沉积[J]. 电化学, 2022, 28(7): 2213006.

DOI: 10.13208/j.electrochem.2213006

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213006

Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang. Research Progress in Electroless Cobalt Plating and the Bottom-up Filling of Electroless Plating[J]. Journal of Electrochemistry, 2022, 28(7): 2213002.

沈钰, 李冰冰, 马艺, 王增林. 化学镀钴和超级化学镀填充的研究进展[J]. 电化学, 2022, 28(7): 2213002.

DOI: 10.13208/j.electrochem.2213002

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213002

Xiao-Li Wang, Wei He, Xian-Ming Chen, Hong Zeng, Yuan-Zhang Su, Chong Wang, Gao-Sheng Li, Ben-Xia Huang, Lei Feng, Gao Huang, Yuan-Ming Chen. Effect of Corrosion Inhibitors on Copper Etching to Form Thick Copper Line of PCB in Acidic Etching Solution[J]. Journal of Electrochemistry, 2022, 28(7): 2213007.

王小丽, 何为, 陈先明, 曾红, 苏元章, 王翀, 李高升, 黄本霞, 冯磊, 黄高, 陈苑明. PCB酸性蚀刻液中缓蚀剂对厚铜线路制作的影响[J]. 电化学, 2022, 28(7): 2213007.

DOI: 10.13208/j.electrochem.2213007

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213007

Xiu-Ren Ni, Ya-Ting Zhang, Chong Wang, Yan Hong, Yuan-Ming Chen, Yuan-Zhang Su, Wei He, Xian-Ming Chen, Ben-Xia Huang, Zhen-Lin Xu, Yi-Feng Li, Neng-Bin Li, Yong-Jie Du. Mechanism and Application of Nickel Nano-Cone by Electrodeposition on a Flexible Substrate[J]. Journal of Electrochemistry, 2022, 28(7): 2213008.

倪修任, 张雅婷, 王翀, 洪延, 陈苑明, 苏元章, 何为, 陈先明, 黄本霞, 续振林, 李毅峰, 李能彬, 杜永杰. 电沉积纳米锥镍的生长机理及其性能的研究[J]. 电化学, 2022, 28(7): 2213008.

DOI: 10.13208/j.electrochem.2213008

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213008

Jia-Ying Xu, Shou-Xu Wang, Yuan-Zhang Su, Yong-Jie Du, Guo-Dong Qi, Wei He, Guo-Yun Zhou, Wei-Hua Zhang, Yao Tang, Yu-Yao Luo, Yuan-Ming Chen. Investigation of Through-Hole Copper Electroplating with Methyl Orange as A Special Leveler[J]. Journal of Electrochemistry, 2022, 28(7): 2213003.

徐佳莹, 王守绪, 苏元章, 杜永杰, 齐国栋, 何为, 周国云, 张伟华, 唐耀, 罗毓瑶, 陈苑明. 特殊整平剂甲基橙在通孔电镀铜的应用[J]. 电化学, 2022, 28(7): 2213003.

DOI: 10.13208/j.electrochem.2213003

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213003

Jia-Qiang Yang, Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Fang-Zu Yang, Dong-Ping Zhan, Zhong-Qun Tian. Electrodeposition Mechanism and Process of a Novel Cyanide-Free Gold Sulfite Bath[J]. Journal of Electrochemistry, 2022, 28(7): 2213005.

杨家强, 金磊, 李威青, 王赵云, 杨防祖, 詹东平, 田中群. 亚硫酸盐无氰电沉积金新工艺及机制[J]. 电化学, 2022, 28(7): 2213005.

DOI: 10.13208/j.electrochem.2213005

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213005

Bai-Zhao Tan, Jian-Lun Liang, Zi-Liang Lai, Ji-Ye Luo. Electrochemical Deposition of Copper Pillar Bumps with High Uniformity[J]. Journal of Electrochemistry, 2022, 28(7): 2213004.

谭柏照, 梁剑伦, 赖子亮, 罗继业. 高均匀性的铜柱凸块电镀[J]. 电化学, 2022, 28(7): 2213004.

DOI: 10.13208/j.electrochem.2213004

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.2213004

KUANG Xian-yin, JIN Shao-qiang, CAO Yan-hui, ZHANG Yan-mei, DONG Shi-gang, ZHU Long-hui, LIN Li-wen, LIN Chang-jian. Effect of Surface Modification of Al Alloy on Adhesion of the Modified Polyurethane (PU) Coating and Its Corrosion Protective Performance[J]. J. Electrochem., 2021, 27(6): 624-636.

况先银, 金少强, 曹艳辉, 张艳梅, 董士刚, 朱龙晖, 林理文, 林昌健. 铝合金表面改性对有机涂层附着力的影响及腐蚀防护性能研究[J]. 电化学, 2021, 27(6): 624-636.

DOI: 10.13208/j.electrochem.210127

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.210127

Chong Wang, Chuan Peng, Jing Xiang, Yuan-Ming Chen, Wei He, Xin-Hong Su, Yu-Yao Luo. Research and Application of Copper Electroplating in Interconnection of Printed Circuit Board[J]. J. Electrochem., 2021, 27(3): 257-268.

王翀, 彭川, 向静, 陈苑明, 何为, 苏新虹, 罗毓瑶. 印制电路中电镀铜技术研究及应用[J]. 电化学, 2021, 27(3): 257-268.

DOI: 10.13208/j.electrochem.201255

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.201255

Zhao-Yun Wang, Lei Jin, Jia-Qiang Yang, Wei-Qing Li, Dong-Ping Zhan, Fang-Zu Yang, Shi-Gang Sun. Studies and Progresses on Hole Metallization in High-Density Interconnected Printed Circuit Boards[J]. J. Electrochem., 2021,27(3): 316-331.

王赵云, 金磊, 杨家强, 李威青, 詹东平, 杨防祖, 孙世刚. 高密度互连印制电路板孔金属化研究和进展[J]. 电化学, 2021, 27(3): 316-331.

DOI: 10.13208/j.electrochem.201119

http://electrochem.xmu.edu.cn/CN/10.13208/j.electrochem.201119

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